Granted Patent B2

US 8,716,846 · App. 13/293,119 · Granted May 6, 2014

Abstract

Claims (12)

1. A packaged pressure sensor die, comprising:

a lead frame with at least one die pad and a plurality of lead fingers that surround the at least one die pad;

a pressure sensor die attached to the die pad and electrically coupled to the lead fingers with bond wires;

a glob top encapsulating material deposited onto a top surface of the lead fingers and filling gaps between the at least one die pad and the lead fingers, and covering the connections of the bond wires to the lead fingers;

a gel disposed on a top surface of the pressure sensor die, and covering the connections of the bond wires to the pressure sensor die; and

a lid that covers the pressure sensor die, the gel and the glob top encapsulating material, wherein the lid penetrates the glop top encapsulating material and contacts the lead frame.

2. The packaged pressure sensor die of claim 1 , wherein the pressure sensor die comprises a piezo resistive transducer (PRT) die.

3. The packaged pressure sensor die of claim 1 , further comprising a second die attached to the top surface of the die pad, and electrically coupled to respective ones of the plurality of lead fingers, wherein the glob top encapsulating material covers both of the dies.

4. The packaged pressure sensor die of claim 1 , wherein the glob top encapsulating material comprises epoxy.

5. The packaged pressure sensor die of claim 1 , wherein the gel comprises silicon-based gel.

6. The packaged pressure sensor die of claim 1 , wherein the packaged pressure sensor die comprises a quad flat no-lead (QFN) package.

7. The packaged pressure sensor die of claim 1 , wherein the lead frame includes tie bars that extend outwardly from the die pad and the lid contacts the tie bars and is electrically isolated from the lead fingers.

Assignments (32)