System and method for ion implantation with improved productivity and uniformity
View Patent ↗A scanning system including a scanning element, a beam profiler, analysis system, and a ZFE-limiting element, is disclosed. The scanning element is configured to scan an ion beam over an ion beam scan path. The beam profiler measures beam current of the ion beam as it is scanned over the ion beam scan path, and the analysis system analyzes the measured beam current to detect a ZFE condition. The ZFE-limiting element, which is upstream of the beam profiler and is coupled to the analysis system via a feedback path, is configured to selectively apply an electric field to the scanned ion beam based on whether the ZFE condition is detected. The selectively applied electric field induces a change in the scanned beam to limit the ZFE condition.
1. An ion implantation system comprising:
an ion source configured to generate an ion beam along a beam path;
a mass analysis component downstream of the ion source configured to perform mass analysis on the ion beam;
a scanning element located downstream of ion source configured to produce a time-varying field which operates upon the ion beam to produce a scanned beam that traverses a scan path;
a beam profiling system configured to measure a beam current of the scanned beam as the scanned beam traverses the scan path;
an analysis system to analyze the measured beam current to detect a zero field effect (ZFE) condition arising from scanning;
a ZFE-limiting element upstream of the beam profiler and coupled to the analysis system via a feedback path, wherein the ZFE-limiting element is configured to limited the ZFE condition, if detected, by selectively applying an electric field to the ion beam based on whether a ZFE condition was detected.
2. The ion implantation system of claim 1 , where the ZFE limiting element applies the electric field only when a ZFE condition has been detected.
3. The ion implantation system of claim 1 , where the time varying field provided by the scanning element is a time-varying magnetic field.
4. The ion implantation system of claim 1 , where the time varying field provided by the scanning element is a time-varying electric field.
5. The ion implantation system of claim 1 , wherein the beam profiling system comprises a faraday cup proximate to an end station of the ion implantation system and configured to measure the beam current or density of the ion beam.
6. The ion implantation system of claim 1 , wherein the ZFE-limiting element is configured to incrementally change a voltage waveform based on whether a ZFE condition is detected.
7. The ion implantation system of claim 6 , wherein the analysis system detects the ZFE condition by determining whether a beam current at some position on the scan path exceeds a base beam current along the scan path.
8. The ion implantation system of claim 1 , wherein the ZFE-limiting element comprises a ring shaped electrode having an inner perimeter that at least substantially surrounds an outer perimeter of a cross-section of the ion beam.
9. The ion implantation system of claim 1 , wherein the ZFE-limiting element comprises at least one plate electrode close to the ion beam.
10. A scanning system for an ion implantation system, comprising:
a magnetic scanner comprising a first magnetic pole and a second magnetic pole configured to produce a magnetic field to scan an ion beam over an ion beam scan path;
a beam profiler to measure beam current of the ion beam as the ion beam is magnetically scanned over the ion beam scan path;
an analysis system to analyze the measured beam current to detect a zero field effect (ZFE) condition occurring in at least one scan position on the ion beam scan path;
a ZFE-limiting element upstream of the beam profiler and coupled to the analysis system via a feedback path, wherein the ZFE-limiting element is configured to selectively apply an electric field to the ion beam based on whether the ZFE condition is detected, wherein the selectively applied electric field induces a change in the ion beam to limit the ZFE condition.
11. The scanning system of claim 10 , wherein the ZFE condition is detected by determining whether the measured beam current for the at least one scan position exceeds a base level for beam current by a predetermined threshold.
12. The scanning system of claim 10 , wherein the ion beam comprises an ion pencil beam running along a beam path and having a trajectory that is modified into a ribbon beam as it passes through the magnetic field.
13. The scanning system of claim 10 , wherein the ZFE-limiting element comprises a ring shaped electrode having an inner perimeter that at least substantially surrounds an outer perimeter of a cross-section of the ion beam.
14. The scanning system of claim 10 , wherein the ZFE-limiting element comprises at least one plate electrode close to the ion beam.
15. A method for improving uniformity of magnetically scanned ion beams in an ion implantation system, comprising:
scanning an ion beam having a beam current or density across a scan path at a scan rate; and
analyzing the scanned ion beam to determine whether a zero-field effect (ZFE) condition is present; and
selectively applying an electric field to the ion beam to mitigate the ZFE condition.
16. The method of claim 15 , wherein analyzing the scanned ion beam comprises measuring a beam current signal as the ion beam is scanned across the scan path.
17. The method of claim 16 , wherein the beam current signal is measured by a faraday cup.
18. The method of claim 15 , wherein the selectively applied electric field is applied only when a ZFE condition has been detected.
19. The method of claim 15 , where scanning the ion beam comprises applying a time-varying magnetic field to the ion beam.
20. The method of claim 15 , where scanning the ion beam comprises applying a time-varying electric field to the ion beam.