Integrated circuit packaging system with leads and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: forming a lead; forming an interior conductive layer having an interior top side and an interior bottom side, the interior bottom side directly on the lead; mounting an integrated circuit over the lead, the integrated circuit having an inactive side and an active side; forming an encapsulation directly on the inactive side and the interior top side; and forming an insulation layer directly on the active side and a portion of the interior bottom side.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming a lead;
forming an interior conductive layer having an interior top side and an interior bottom side, the interior bottom side directly on the lead;
mounting an integrated circuit over the lead, the integrated circuit having an inactive side and an active side;
forming an encapsulation directly on the inactive side and the interior top side; and
forming an insulation layer directly on the active side and a portion of the interior bottom side.
2. The method as claimed in claim 1 wherein forming the encapsulation includes forming the encapsulation having an encapsulation bottom side coplanar with the interior bottom side.
3. The method as claimed in claim 1 further comprising connecting an internal connector to the integrated circuit and the interior conductive layer, the internal connector horizontally surrounded by the leads.
4. The method as claimed in claim 1 further comprising:
forming a vertical connector directly on the interior top side, the vertical connector having a connector top side; and
wherein:
forming the encapsulation includes forming the encapsulation exposing the connector top side.
5. The method as claimed in claim 1 wherein forming the insulation layer includes forming the insulation layer having an insulation step portion with the active side directly thereon.
6. A method of manufacture of an integrated circuit packaging system comprising:
forming a lead;
forming an interior conductive layer having an interior top side and an interior bottom side, the interior bottom side directly on the lead;
mounting an integrated circuit over the lead, the integrated circuit having an inactive side and an active side;
forming an encapsulation directly on the inactive side and the interior top side; and
forming an insulation layer directly on the lead, the active side, and a portion of the interior bottom side.
7. The method as claimed in claim 6 further comprising forming an additional interior conductive layer directly over the first interior conductive layer.
8. The method as claimed in claim 6 further comprising attaching a heat sink to the interior bottom side.
9. The method as claimed in claim 6 further comprising mounting an additional integrated circuit over the integrated circuit, the additional integrated circuit having an additional inactive side facing the inactive side.
10. The method as claimed in claim 6 further comprising:
forming a vertical connector on the lead; and
attaching an external connector to the vertical connector.
11. An integrated circuit packaging system comprising:
a lead;
an interior conductive layer having an interior top side and an interior bottom side, the interior bottom side directly on the lead;
an integrated circuit over the lead, the integrated circuit having an inactive side and an active side;
an encapsulation directly on the inactive side and the interior top side; and
an insulation layer directly on the active side and a portion of the interior bottom side.
12. The system as claimed in claim 11 wherein the encapsulation includes an encapsulation bottom side coplanar with the interior bottom side.
13. The system as claimed in claim 11 further comprising an internal connector connected to the integrated circuit and the interior conductive layer, the internal connector horizontally surrounded by the leads.
14. The system as claimed in claim 11 further comprising:
a vertical connector directly on the interior top side, the vertical connector having a connector top side; and
wherein:
the encapsulation exposes the connector top side.
15. The system as claimed in claim 11 wherein the insulation layer includes an insulation step portion with the active side directly thereon.
16. The system as claimed in claim 11 wherein the insulation layer is directly on the lead.
17. The system as claimed in claim 16 further comprising a second interior conductive layer directly over the first interior conductive layer.
18. The system as claimed in claim 16 further comprising a heat sink attached to the interior bottom side.
19. The system as claimed in claim 16 further comprising an additional integrated circuit over the integrated circuit, the additional integrated circuit having an additional inactive side facing the inactive side.
20. The system as claimed in claim 16 further comprising:
a vertical connector on the lead; and
an external connector attached to the vertical connector.