Magneto-resistive random access memory (MRAM) having a plurality of concentrically aligned magnetic tunnel junction layers and concentrically aligned upper electrodes over a lower electrode
A method for manufacturing a semiconductor memory device includes forming a magnetic tunnel junction layer on a lower electrode, forming a spacer having an annular shape on the magnetic tunnel junction layer, forming upper electrodes on both sidewall surfaces of the annular shaped spacer, removing the spacer, and etching the magnetic tunnel junction layer by using the upper electrodes as an etch mask.
1. A semiconductor memory device, comprising:
a plurality of magnetic tunnel junction elements configured to store data; and
a transistor commonly connected to the plurality of magnetic tunnel junctions elements,
wherein the plurality of magnetic tunnel junction elements having an inner magnetic tunnel junction element and an outer magnetic tunnel junction element concentrically aligned over a lower electrode, and
wherein a radius of each of the magnetic tunnel junction elements being smaller than that of the lower electrode.
2. The semiconductor memory device as recited in claim 1 , wherein the plural magnetic tunnel junction elements have one shape selected from the group of circle, oval, and polygon.
3. The semiconductor memory device as recited in claim 1 , wherein the plural magnetic tunnel junction elements respectively have different tunneling characteristics.
4. The semiconductor memory device as recited in claim 1 , further comprises concentrically aligned upper electrode formed over each magnetic tunnel junction element, wherein the upper electrode includes at least one selected from the group of TiN and WN.
5. The semiconductor memory device as recited in claim 1 , wherein the lower electrode includes at least one selected from the group of TiN and TaN.
6. The semiconductor memory device of claim 1 , wherein the plurality of concentrically aligned magnetic tunnel junction elements and plurality of concentrically aligned upper electrodes are annular shaped.
7. The semiconductor memory device of claim 1 , wherein the transistor is coupled to a bit line, a source line, and a word line.