Attaching device and attaching apparatus for supporting plate, and attaching method for supporting plate
An attaching method for attaching a support plate to a surface of a substrate with an adhesive involves the steps of applying an adhesive to the surface of the substrate, heating and thereafter cooling the substrate, positioning centers of the substrate and the supporting plate to coincide with each other, and forming a layered structure by pushing the supporting plate onto the substrate with the adhesive therebetween in a pressure-reduced atmosphere. In the positioning step, after the supporting late has been placed on the substrate, it is possible to finely adjust the alignment of the supporting plate and a semiconductor wafer when attached because the adhesive is applied to the surface of the substrate, and thereafter the substrate is heated and cooled.
1. An attaching method for attaching a supporting plate to a surface of a substrate with an adhesive, comprising the steps of: applying an adhesive to the surface of the substrate; heating and thereafter cooling the substrate; positioning a center of the substrate and the center of the supporting plate to coincide with each other; and forming a layered structure by pushing the supporting plate onto the substrate in a pressure-reduced atmosphere: wherein the positioning step involves use of a pair of alignment members arranged to freely move back and forth in a horizontal direction, and blades for supporting a lower surface of a periphery of the supporting plate and pushing members for performing positioning in a state where the supporting plate is superposed on the substrate are provided at tip ends of the alignment members, wherein each of said pushing members includes a pair of rollers, a thickness of the rollers is larger than a combined thickness of the substrate and the adhesive, and the supporting plate is supported only by the blades before the supporting plate is adhesively bonded to the substrate.
2. The attaching method according to claim 1 , wherein said forming step involves use of a mounting plate and a pressing plate located within a chamber which is connected to a vacuum source, and the alignment members which are arranged to move back and forth by penetrating the side walls of the chamber.
3. The attaching method according to claim 2 , wherein the mounting plate has a temperature-adjusting mechanism.
4. The attaching method according to claim 2 , wherein the pressing plate has a temperature-adjusting mechanism.