IP Library Assignment 063286/0683
Patent Assignment
Reel/Frame 063286/0683

Change of Name

Recorded: 2023-04-11 Pages: 6
Assignor
Assignee
AIMECHATEC, LTD.
5-2, KOYODAI,, RYUGASAKI-SHI, IBARAKI, JAPAN
Covered Properties (34)
Film Forming Apparatus, Film Forming Method and Tray for Substrate
Patent: 7,005,009 →
Application: 10/308,964 →
Publication: US 2003/0134044
Coating Apparatus, Coating Method and Coating-Film Forming Apparatus
Patent: 8,449,945 →
Application: 13/364,739 →
Publication: US 2012/0141682
Coating Apparatus, Coating Method and Coating-Film Forming Apparatus
Patent: 8,132,526 →
Application: 12/584,103 →
Publication: US 2010/0009084
Coating Apparatus, Coating Method and Coating-Film Forming Apparatus
Patent: 7,611,581 →
Application: 11/288,991 →
Publication: US 2006/0115992
Attaching Device and Attaching Apparatus for Supporting Plate, and Attaching Method for Supporting Plate
Patent: 8,931,535 →
Application: 13/369,448 →
Publication: US 2012/0132359
Attaching Device and Attaching Apparatus for Supporting Plate, and Attaching Method for Supporting Plate
Patent: 8,136,564 →
Application: 11/633,604 →
Publication: US 2007/0125495
Liquid Solvent Abutment Unit
Patent: 8,449,691 →
Application: 12/448,916 →
Publication: US 2010/0024853
Processing Apparatus Fluid-Processing a Process Target Body
Patent: 8,720,456 →
Application: 12/515,891 →
Publication: US 2010/0051068
Treatment Device, Treatment Method, and Surface Treatment Jig
Patent: 9,129,999 →
Application: 12/514,193 →
Publication: US 2010/0037916
Sucking and Holding Device
Patent: 8,297,568 →
Application: 12/379,703 →
Publication: US 2009/0218460
Treatment Liquid Permeation Unit and Treating Apparatus
Patent: 8,181,660 →
Application: 12/322,156 →
Publication: US 2009/0218050
Separating Device
Patent: 8,186,410 →
Application: 12/326,340 →
Publication: US 2009/0139662
Stage for Substrate
Patent: 8,336,866 →
Application: 12/384,719 →
Publication: US 2009/0250855
Separating Apparatus and Separating Method
Patent: 8,701,734 →
Application: 12/453,816 →
Publication: US 2009/0314430
Separating Apparatus and Separating Method
Patent: 8,297,331 →
Application: 12/492,620 →
Publication: US 2010/0000680
Alignment Apparatus and Alignment Method
Patent: 8,205,349 →
Application: 12/818,518 →
Publication: US 2010/0319209
Method of Cleaning Support Plate
Patent: 8,097,087 →
Application: 12/837,790 →
Publication: US 2011/0017231
Stripping Device and Stripping Method
Patent: 8,302,651 →
Application: 13/093,412 →
Publication: US 2011/0259527
Method for Processing Process-Target Object
Patent: 8,882,930 →
Application: 13/151,624 →
Publication: US 2011/0297190
Retention Device and Retention Method
Patent: 9,406,542 →
Application: 14/125,537 →
Publication: US 2014/0109941
Method of Manufacturing Multilayer Body, Method of Processing Substrate, and Multilayer Body
Application: 14/127,315 →
Publication: US 2014/0141253
Substrate Processing Apparatus and Substrate Processing Method
Patent: 9,281,225 →
Application: 13/670,159 →
Publication: US 2013/0113147
Method of Manufacturing Laminate
Patent: 9,023,172 →
Application: 14/377,140 →
Publication: US 2015/0000834
Supporting Member Separation Method and Supporting Member Separation Apparatus
Application: 14/377,711 →
Publication: US 2015/0083343
Attaching Apparatus
Patent: 9,548,232 →
Application: 14/408,903 →
Publication: US 2015/0325463
Overlapping Device, and Overlapping Method
Patent: 9,911,637 →
Application: 14/409,137 →
Publication: US 2015/0194329
Transport Arm, Transport Apparatus and Transport Method
Patent: 9,653,337 →
Application: 14/071,060 →
Publication: US 2014/0169929
Attaching Device and Attaching Method
Patent: 9,337,074 →
Application: 14/431,902 →
Publication: US 2015/0262858
Attachment Method
Patent: 9,484,238 →
Application: 14/439,430 →
Publication: US 2016/0005635
Method for Processing Mold Material and Method for Manufacturing Structural Body
Application: 14/270,086 →
Publication: US 2014/0332149
Sticking Apparatus and Sticking Method
Patent: 9,272,494 →
Application: 14/270,024 →
Publication: US 2014/0332147
Supporting Member Separation Apparatus and Supporting Member Separation Method
Patent: 9,238,357 →
Application: 14/202,445 →
Publication: US 2014/0318714
Method for Manufacturing Laminate, Method for Manufacturing Sealed Substrate Laminate, Sealed Substrate Laminate, and Sealed Substrate
Patent: 9,837,298 →
Application: 14/940,506 →
Publication: US 2016/0163579
Carrying Method and Bonding Apparatus
Application: 14/945,959 →
Publication: US 2016/0158939
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 3, 2002
From: AOKI, TAIICHIRO; OHISHI, SEIJI; YAMABE, HIROSHI; OBATA, HITOSHI
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 013550/0054 →
Assignment of Assignor's Interest Dec 3, 2002
From: AOKI, TAIICHIRO; OHISHI, SEIJI; YAMABE, HIROSHI; OBATA, HITOSHI
To: TAZMO CO., LTD.
Reel/Frame 013550/0091 →
Assignment of Assignor's Interest Jan 30, 2006
From: OHISHI, SEIJI; NAKAMURA, AKIHIKO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 017518/0640 →
Assignment of Assignor's Interest Dec 4, 2006
From: NAKAMURA, AKIHIKO; MIYANARI, ATSUSHI; INAO, YOSHIHIRO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 018649/0464 →
Assignment of Assignor's Interest Jan 7, 2009
From: NAKAMURA, AKIHIKO; KATSURAGAWA, JUNICHI; MIYANARI, ATSUSHI; INAO, YOSHIHIRO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022103/0332 →
Assignment of Assignor's Interest Jan 29, 2009
From: NAKAMURA, AKIHIKO; KATSURAGAWA, JUNICHI; IWATA, YASUMASA
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022257/0821 →
Assignment of Assignor's Interest Feb 26, 2009
From: NAKAMURA, AKIHIKO; KATSURAGAWA, JUNICHI
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022383/0953 →
Re-Record to Correct the Receiving Party on a Document Previously Recorded at Reel 022103, Frame 0332. (Assignment of Assignor's Interest) Mar 16, 2009
From: NAKAMURA, AKIHIKO; KATSURAGAWA, JUNICHI; MIYANARI, ATSUSHI; INAO, YOSHIHIRO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022406/0217 →
Assignment of Assignor's Interest Apr 28, 2009
From: FUJII, YASUSHI; HASEGAWA, TAKUMA
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022614/0107 →
Assignment of Assignor's Interest May 8, 2009
From: IWATA, YASUMASA; NAKAMURA, AKIHIKO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022658/0698 →
Assignment of Assignor's Interest May 22, 2009
From: NAKAMURA, AKIHIKO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022770/0616 →
Corrective Assignment to Correct the Assignee Address Previously Recorded on Reel 022658 Frame 0698. Assignor(S) Hereby Confirms the Nakamarukko Should Be Spelled Nakamaruko.. Jun 25, 2009
From: IWATA, YASUMASA; NAKAMURA, AKIHIKO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022875/0376 →
Assignment of Assignor's Interest Jun 30, 2009
From: INAO, YOSHIHIRO; NAKAMURA, AKIHIKO; IWATA, YASUMASA
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022931/0438 →
Assignment of Assignor's Interest Jul 15, 2009
From: NAKAMURA, AKIHIKO; MIYANARI, ATSUSHI; INAO, YOSHIHIRO; IWATA, YASUMASA
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022985/0467 →
Assignment of Assignor's Interest Oct 14, 2009
From: MIYANARI, ATSUSHI
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 023368/0387 →
Assignment of Assignor's Interest Jun 18, 2010
From: NAKAMURA, AKIHIKO; KATSURAGAWA, JUNICHI; KOBARI, SATOSHI; SASAKI, TAMOTSU
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 024560/0890 →
Assignment of Assignor's Interest Jul 16, 2010
From: MITAKE, TATSUHIRO; MIYANARI, ATSUSHI; INAO, YOSHIHIRO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 024699/0942 →
Change of Name Mar 28, 2023
From: TOKYO OHKA KOGYO CO., LTD.
To: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
Reel/Frame 063186/0289 →