IP Library Granted Patent US 8,097,087
Granted Patent B2
US 8,097,087 · App. 12/837,790 · Granted Jan 17, 2012

Method of cleaning support plate

Assignee: Tokyo Ohka Kogyo Co., Ltd.
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Quick Facts
Patent No.
US 8,097,087
App. No.
12/837,790
Granted
Jan 17, 2012
Kind
B2
Abstract

A method of cleaning a support plate according to which, while no waste solution is produced after cleaning the support plate, the support plate can be treated at low cost. The method of cleaning the support plate includes the step of removing an organic substance adhered to the support plate by putting the support plate in contact with oxygen plasma.

Claims (9)

1. A method of cleaning a support plate, the support plate being a support plate prior to attachment to a substrate or a support plate from which a substrate has been separated, the method consisting of:

adhering a metal and an organic substance to the support plate, the metal being at least one of Al, Ti, Zr, Cd, Au, Ag, Pt, Pd, Zn, Ni, and Cu;

removing the organic substance adhered to the support plate by putting the support plate in contact with oxygen plasma; and

removing the metal adhered to a surface of a front side of the support plate by irradiating laser light onto the support plate,

wherein said removing metal adhered to the surface of the front side of the support plate by irradiating laser light onto the support plate includes irradiating laser light onto the support plate such that the laser light is directed from a backside of the support plate, the backside of the support plate being opposite the front side of the support plate.

2. The method of cleaning the support plate as set forth in claim 1 , wherein:

said putting the support plate in contact with oxygen plasma is putting both sides of the support plate in contact with oxygen plasma.

3. The method of cleaning the support plate as set forth in claim 1 , wherein:

said removing the metal is performed after said removing the organic substance.

Assignments (3)
CHANGE OF NAME Recorded Apr 11, 2023
From: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
To: AIMECHATEC, LTD.
Reel/Frame 063286/0683 →
CHANGE OF NAME Recorded Mar 28, 2023
From: TOKYO OHKA KOGYO CO., LTD.
To: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
Reel/Frame 063186/0289 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2010
From: MITAKE, TATSUHIRO; MIYANARI, ATSUSHI; INAO, YOSHIHIRO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 024699/0942 →
Priority Claims (1)
JP 2009-170012 · Jul 21, 2009 · national
Continuity (1)
Related Publication 20110017231A1 · Jan 27, 2011