Patent Assignment
Reel/Frame 063186/0289
Change of Name
Recorded: 2023-03-28
Pages: 6
Assignor
TOKYO OHKA KOGYO CO., LTD.
Executed: 2023-03-01
Assignee
PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
150 NAKAMARUKO, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-0012, JAPAN
Covered Properties
(34)
Film Forming Apparatus, Film Forming Method and Tray for Substrate
Coating Apparatus, Coating Method and Coating-Film Forming Apparatus
Coating Apparatus, Coating Method and Coating-Film Forming Apparatus
Coating Apparatus, Coating Method and Coating-Film Forming Apparatus
Attaching Device and Attaching Apparatus for Supporting Plate, and Attaching Method for Supporting Plate
Attaching Device and Attaching Apparatus for Supporting Plate, and Attaching Method for Supporting Plate
Liquid Solvent Abutment Unit
Processing Apparatus Fluid-Processing a Process Target Body
Treatment Device, Treatment Method, and Surface Treatment Jig
Sucking and Holding Device
Treatment Liquid Permeation Unit and Treating Apparatus
Separating Device
Stage for Substrate
Separating Apparatus and Separating Method
Separating Apparatus and Separating Method
Alignment Apparatus and Alignment Method
Method of Cleaning Support Plate
Stripping Device and Stripping Method
Method for Processing Process-Target Object
Retention Device and Retention Method
Method of Manufacturing Multilayer Body, Method of Processing Substrate, and Multilayer Body
Substrate Processing Apparatus and Substrate Processing Method
Method of Manufacturing Laminate
Supporting Member Separation Method and Supporting Member Separation Apparatus
Attaching Apparatus
Overlapping Device, and Overlapping Method
Transport Arm, Transport Apparatus and Transport Method
Attaching Device and Attaching Method
Attachment Method
Method for Processing Mold Material and Method for Manufacturing Structural Body
Sticking Apparatus and Sticking Method
Supporting Member Separation Apparatus and Supporting Member Separation Method
Method for Manufacturing Laminate, Method for Manufacturing Sealed Substrate Laminate, Sealed Substrate Laminate, and Sealed Substrate
Carrying Method and Bonding Apparatus
Related Assignments
(18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 3, 2002
From: AOKI, TAIICHIRO; OHISHI, SEIJI; YAMABE, HIROSHI; OBATA, HITOSHI
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 013550/0054 →
Assignment of Assignor's Interest
Dec 3, 2002
From: AOKI, TAIICHIRO; OHISHI, SEIJI; YAMABE, HIROSHI; OBATA, HITOSHI
To: TAZMO CO., LTD.
Reel/Frame 013550/0091 →
Assignment of Assignor's Interest
Jan 30, 2006
From: OHISHI, SEIJI; NAKAMURA, AKIHIKO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 017518/0640 →
Assignment of Assignor's Interest
Dec 4, 2006
From: NAKAMURA, AKIHIKO; MIYANARI, ATSUSHI; INAO, YOSHIHIRO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 018649/0464 →
Assignment of Assignor's Interest
Jan 7, 2009
From: NAKAMURA, AKIHIKO; KATSURAGAWA, JUNICHI; MIYANARI, ATSUSHI; INAO, YOSHIHIRO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022103/0332 →
Assignment of Assignor's Interest
Jan 29, 2009
From: NAKAMURA, AKIHIKO; KATSURAGAWA, JUNICHI; IWATA, YASUMASA
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022257/0821 →
Assignment of Assignor's Interest
Feb 26, 2009
From: NAKAMURA, AKIHIKO; KATSURAGAWA, JUNICHI
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022383/0953 →
Re-Record to Correct the Receiving Party on a Document Previously Recorded at Reel 022103, Frame 0332. (Assignment of Assignor's Interest)
Mar 16, 2009
From: NAKAMURA, AKIHIKO; KATSURAGAWA, JUNICHI; MIYANARI, ATSUSHI; INAO, YOSHIHIRO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022406/0217 →
Assignment of Assignor's Interest
Apr 28, 2009
From: FUJII, YASUSHI; HASEGAWA, TAKUMA
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022614/0107 →
Assignment of Assignor's Interest
May 8, 2009
From: IWATA, YASUMASA; NAKAMURA, AKIHIKO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022658/0698 →
Assignment of Assignor's Interest
May 22, 2009
From: NAKAMURA, AKIHIKO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022770/0616 →
Corrective Assignment to Correct the Assignee Address Previously Recorded on Reel 022658 Frame 0698. Assignor(S) Hereby Confirms the Nakamarukko Should Be Spelled Nakamaruko..
Jun 25, 2009
From: IWATA, YASUMASA; NAKAMURA, AKIHIKO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022875/0376 →
Assignment of Assignor's Interest
Jun 30, 2009
From: INAO, YOSHIHIRO; NAKAMURA, AKIHIKO; IWATA, YASUMASA
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022931/0438 →
Assignment of Assignor's Interest
Jul 15, 2009
From: NAKAMURA, AKIHIKO; MIYANARI, ATSUSHI; INAO, YOSHIHIRO; IWATA, YASUMASA
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 022985/0467 →
Assignment of Assignor's Interest
Oct 14, 2009
From: MIYANARI, ATSUSHI
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 023368/0387 →
Assignment of Assignor's Interest
Jun 18, 2010
From: NAKAMURA, AKIHIKO; KATSURAGAWA, JUNICHI; KOBARI, SATOSHI; SASAKI, TAMOTSU
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 024560/0890 →
Assignment of Assignor's Interest
Jul 16, 2010
From: MITAKE, TATSUHIRO; MIYANARI, ATSUSHI; INAO, YOSHIHIRO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 024699/0942 →
Change of Name
Apr 11, 2023
From: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
To: AIMECHATEC, LTD.
Reel/Frame 063286/0683 →