IP Library Granted Patent US 9,837,298
Granted Patent B2
US 9,837,298 · App. 14/940,506 · Granted Dec 5, 2017

Method for manufacturing laminate, method for manufacturing sealed substrate laminate, sealed substrate laminate, and sealed substrate

Inventors: Akihiko Nakamura (Kawasaki, JP); Kimihiro Nakada (Kawasaki, JP)
Assignee: TOKYO OHKA KOGYO CO., LTD.
H01L21/6835B32B37/182B32B38/0012H01L21/4803H01L21/565H01L23/3121B32B3/02B32B3/085B32B3/10B32B3/30B32B7/06B32B7/12B32B9/04B32B27/283B32B27/308B32B38/10B32B2037/1253B32B2037/268B32B2038/0016B32B2250/44B32B2255/10B32B2255/26B32B2307/732B32B2307/748B32B2310/0831B32B2457/08B32B2457/14H01L21/568H01L2221/68318H01L2221/68331H01L2221/68345H01L2221/68381H01L2924/0002H01L2924/181
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Quick Facts
Patent No.
US 9,837,298
App. No.
14/940,506
Granted
Dec 5, 2017
Kind
B2
Abstract

A laminate manufactured by forming a step difference in a substrate by grinding a periphery edge portion to have such a size that a surface on the inner side of the step difference can be housed in a cavity of a die, and then laminating the substrate, an adhesive layer, a release layer, and a support plate in this order such that the surface on the inner side of the step difference of the substrate faces the support plate.

Claims (14)

1. A method for manufacturing a laminate, comprising:

forming a step difference by grinding a periphery edge portion of a substrate to have such a size that a surface on an inner side of the step difference can be housed in a cavity of a die; and

forming a laminate by laminating the substrate, an adhesive layer, a release layer altered by light absorption, and a support formed of a light transmitting material in this order after the forming of the step difference,

wherein in the forming of the laminate, the substrate is laminated such that the surface on the inner side of the step difference of the substrate faces the support.

2. The method for manufacturing a laminate according to claim 1 , further comprising:

thinning the substrate from a rear side of a facing surface in which the step difference is formed until the step difference is eliminated after the forming of the laminate.

3. A method for manufacturing a sealed substrate laminate, comprising:

manufacturing a laminate by the method according to claim 2 ;

forming a sealed substrate laminate by sealing at least the substrate with a sealing material supplied to a space which formed between the die and the laminate by setting the laminate in the die such that the substrate is housed in the cavity of the die and covering the cavity with the support after the thinning of the substrate; and

releasing the sealed substrate laminate from the die after the forming of the sealed substrate laminate.

4. A method for manufacturing a sealed substrate, comprising:

manufacturing a sealed substrate laminate by the method according to claim 3 ; and

separating the support from the sealed substrate laminate by irradiating the release layer with light through the support and altering the release layer after the manufacturing of the sealed substrate laminate.

5. The method for manufacturing a laminate according to claim 1 , wherein in the laminate forming process, a notched portion formed on the substrate and a notched portion formed on the support are arranged to be overlapped with each other so that the substrate is overlapped with the support.

Assignments (3)
CHANGE OF NAME Recorded Apr 11, 2023
From: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
To: AIMECHATEC, LTD.
Reel/Frame 063286/0683 →
CHANGE OF NAME Recorded Mar 28, 2023
From: TOKYO OHKA KOGYO CO., LTD.
To: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
Reel/Frame 063186/0289 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 8, 2016
From: NAKAMURA, AKIHIKO; NAKADA, KIMIHIRO
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 037439/0841 →
Priority Claims (1)
JP 2014-245389 · Dec 3, 2014 · national
Continuity (1)
Related Publication 20160163579A1 · Jun 9, 2016