IP Library › Assignment 037439/0841
Patent Assignment
Reel/Frame 037439/0841

Assignment of Assignor's Interest

Recorded: 2016-01-08 Pages: 3
Assignors
NAKAMURA, AKIHIKO
Executed: 2015-10-09
NAKADA, KIMIHIRO
Executed: 2015-10-07
Assignee
TOKYO OHKA KOGYO CO., LTD.
150 NAKAMARUKO, NAKAHARA-KU, KANAGAWA, KAWASAKI-SHI, 211-0012, JAPAN
Covered Property (1)
Method for Manufacturing Laminate, Method for Manufacturing Sealed Substrate Laminate, Sealed Substrate Laminate, and Sealed Substrate
Patent: 9,837,298 →
Application: 14/940,506 →
Publication: US 2016/0163579
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 28, 2023
From: TOKYO OHKA KOGYO CO., LTD.
To: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
Reel/Frame 063186/0289 →
Change of Name Apr 11, 2023
From: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
To: AIMECHATEC, LTD.
Reel/Frame 063286/0683 →