IP Library Granted Patent US 9,911,637
Granted Patent B2
US 9,911,637 · App. 14/409,137 · Granted Mar 6, 2018

Overlapping device, and overlapping method

Inventors: Junichi Katsuragawa (Kawasaki, JP); Satoshi Kobari (Kawasaki, JP)
Assignee: Tokyo Ohka Kogyo Co., Ltd.
H01L21/681G06T7/0004G06T11/60H01L21/68H01L21/6835H01L21/6836H01L21/68785G06T2207/30108H01L2221/6834H01L2221/68318H01L2221/68327H01L2221/68331H01L2221/68381
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Quick Facts
Patent No.
US 9,911,637
App. No.
14/409,137
Granted
Mar 6, 2018
Kind
B2
Abstract

An overlapping device which is configured to detect the center positions of a substrate and a support which are held in a center position detecting portion, carry the substrate and the support from the center position detecting portion to an overlapping portion, and overlap the substrate and the support such that the detected center positions of the substrate and the support are overlapped in the overlapping portion.

Claims (22)

1. An overlapping device, comprising:

an overlapping position at which a substrate and a support for supporting the substrate are overlapped;

a plurality of cameras imaging an end surface of the substrate and the support before being overlapped at a holding position located completely outside the overlapping position;

an image processor detecting respective center positions of the substrate and the support from a plurality of images of the end surface of the substrate and the support imaged by the plurality of cameras; and

a rotatable arm attached to a pivot point carrying the substrate and the support from the holding position to the overlapping position; and

a moveable support with a flange adapted to adjust a position in an in-plane direction of at least one of the substrate and the support at the overlapping position by overlapping the respective center positions of the substrate and the support with a predetermined central axis, such that the respective center positions of the substrate and the support detected by the image processor are overlapped with each other.

2. The overlapping device according to claim 1 ,

wherein the cameras have a first camera imaging a first end surface of the substrate and the support and a second camera imaging a second end surface in a position different from the first end surface of the substrate and the support.

3. The overlapping device according to claim 1 ,

wherein an adhesive layer is laminated on at least one of the substrate and the support, and wherein the overlapping position overlaps the substrate and the support through the adhesive layer.

4. The overlapping device according to claim 1 ,

wherein the overlapping position has a supporter of the substrate and the support hook, and

wherein one of the substrate and the support is overlapped onto the other of the substrate supported by the supporter and the support such that the center positions of the substrate and the support are overlapped with each other.

5. An overlapping method, comprising:

imaging the end surface of a substrate and support by a plurality of cameras before being overlapped which are held in a holding position;

detecting respective center positions of the substrate and the support with an image processor from a plurality of images imaged by the plurality of cameras;

carrying the substrate and the support of which the center positions are detected from the holding position to an overlapping position completely outside the holding position; and

overlapping the center positions of the substrate and the support detected by the image processor in the overlapping position by adjusting,

at least one of the substrate and the support in an in-plane direction after the substrate and the support are carried to the overlapping position by overlapping the respective center positions of the substrate and the support with a predetermined central axis, such that the respective center positions of the substrate and the support are overlapped with each other.

6. The overlapping device according to claim 4 , wherein:

the supporter has a set surface for one of the substrate and the support; and

a groove is formed on the set surface.

Assignments (3)
CHANGE OF NAME Recorded Apr 11, 2023
From: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
To: AIMECHATEC, LTD.
Reel/Frame 063286/0683 →
CHANGE OF NAME Recorded Mar 28, 2023
From: TOKYO OHKA KOGYO CO., LTD.
To: PROCESS EQUIPMENT BUSINESS SPIN-OFF PREPARATION CO., LTD.
Reel/Frame 063186/0289 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2015
From: KATSURAGAWA, JUNICHI; KOBARI, SATOSHI
To: TOKYO OHKA KOGYO CO., LTD.
Reel/Frame 034652/0866 →
Priority Claims (1)
JP 2012-142389 · Jun 25, 2012 · national
Continuity (1)
Related Publication 20150194329A1 · Jul 9, 2015