MOSFET with work function adjusted metal backgate
An SOI substrate, a semiconductor device, and a method of backgate work function tuning. The substrate and the device have a plurality of metal backgate regions wherein at least two regions have different work functions. The method includes forming a mask on a substrate and implanting a metal backgate interposed between a buried oxide and bulk regions of the substrate thereby producing at least two metal backgate regions having different doses of impurity and different work functions. The work function regions can be aligned such that each transistor has different threshold voltage. When a top gate electrode serves as the mask, a metal backgate with a first work function under the channel region and a second work function under the source/drain regions is formed. The implant can be tilted to shift the work function regions relative to the mask.
1. A method of backgate work function tuning comprising:
forming a mask over a portion of a semiconductor on insulator (SOI) substrate, wherein the substrate has a SOI layer, a buried insulator (BOX), a bulk layer, and a metal backgate between the BOX and the bulk layer and wherein the mask is a patterned gate stack;
implanting the substrate with a species to form a first region of the metal backgate which lacks the implanted species and a second region of the metal backgate which contains the implanted species;
forming a second mask having an opening above the first region of the metal backgate; and
performing a second implantation to place implanted species in the first region of the metal backgate.
2. The method of claim 1 , further comprising:
annealing the substrate after implantation.
3. The method of claim 1 , wherein ion implanting comprises implanting at a tilt angle.
4. A method of backgate work function tuning comprising:
forming a mask over a portion of a semiconductor on insulator (SOI) substrate wherein the substrate has a SOI layer, a buried insulator (BOX), a bulk layer, and a metal backgate between the BOX and the bulk layer; and
implanting the substrate with a species to form a first region of the metal backgate which lacks the implanted species and a second region of the metal backgate which contains the irnpianted species;
wherein the first region has a first work function and the second region has a second work function.
5. The method of claim 4 , further comprising:
annealing the substrate after implantation.
6. The method of claim 4 , wherein ion implanting comprises implanting at a tilt angle.