Combined device identification and temperature measurement
View Patent ↗Both a device-identification feature and a temperature-sensor feature are combined on a single integrated circuit. In various embodiments, both features are not operative simultaneously.
1. An integrated circuit, comprising thereon:
a device-identification circuit for identifying the integrated circuit, the device-identification circuit having a first polarity;
a temperature sensor connected in parallel with the device-identification circuit for determining a temperature of the integrated circuit, the temperature sensor having a second polarity that is different than the first polarity; and
an opaque layer covering at least the temperature sensor to prevent photocurrent generation therein;
the temperature sensor being configured to operate in response to a first signal and the device identification circuit being configured to be nonoperational in response to the first signal; and
the device-identification circuit being configured to operate in response to a second signal different than the first signal and the temperature sensor being configured to be nonoperational in response to the second signal.
2. The integrated circuit of claim 1 , wherein the device-identification circuit comprises a resistor connected to a diode-connected transistor.
3. The integrated circuit of claim 2 , wherein the temperature sensor is a diode.
4. The integrated circuit of claim 1 , wherein the integrated circuit comprises an image sensor.
5. The integrated circuit of claim 1 , further comprising a bond pad configured to receive the first signal and the second signal, the device-identification circuit being coupled to the bond pad and the temperature sensor being coupled to the bond pad.
6. An integrated circuit, comprising thereon:
a device-identification circuit comprising a resistor connected between a diode-connected transistor and a first reference voltage, wherein the diode-connected transistor has a first polarity relative to the first reference voltage,
a temperature sensor diode connected in parallel with the device-identification circuit and having a second polarity being different than the first polarity relative to a second reference voltage, and
an opaque layer covering at least the temperature sensor to prevent photocurrent generation therein.
7. The integrated circuit of claim 6 , wherein the integrated circuit comprises an image sensor.
8. The integrated circuit of claim 6 , wherein the first and second reference voltages are the same.
9. The integrated circuit of claim 8 , wherein the first and second reference voltages are ground.
10. A system for identifying a device and to measure its temperature, the system having a power supply connected to a common node and comprising:
a device-identification circuit connected between the common node;
a temperature sensor in parallel with the device-identification circuit and coupled to the common node, and
an opaque layer covering at least the temperature sensor to prevent photocurrent generation therein:
the device-identification circuit configured to be placed in an ON state in response to a first voltage having a first polarity and the temperature sensor being configured to be placed in an OFF state in response to the first voltage, and
the temperature sensor configured to be placed in an ON state in response to a second voltage having a second polarity and the device-identification circuit being configured to be placed in an OFF state in response to the second voltage; wherein the second and first polarity is different.
11. The system of claim 10 , wherein the device-identification circuit includes a diode-connected transistor connected to a resistor, the diode-connected transistor having a first polarity and being connected to the common node, and the resistor being connected between the diode-connected transistor and the first reference voltage.
12. The system of claim 11 , wherein the temperature sensor is a diode having a second polarity.
13. The system of claim 10 , further comprising a second resistor connected between the power supply and the common node.
14. The system of claim 13 , wherein the power supply and the second resistor are disposed in an image-capture device.
15. The system of claim 14 , wherein the device-identification circuit and the temperature sensor diode are disposed in an image sensor.
16. The integrated circuit of claim 15 , further comprising a bond pad, the device-identification circuit being coupled to the bond pad and the temperature sensor diode being coupled to the bond pad.
17. The system of claim 10 , further comprising:
a processor connected to the integrated circuit;
a memory connected to the processor; and
a driver circuit connected to the processor and to the integrated circuit.
18. The system of claim 17 , wherein the memory contains a look-up table relating different resistance values to associated devices, the processor being configured to identify the device based on a substantial match between a value in the look-up table and a value of the identification-circuit resistor.
19. The system of claim 17 , wherein the memory contains a look-up table relating different values of an electrical parameter of the temperature sensor to associated temperatures, the processor being configured to identify a device temperature based on a substantial match between a present value of the electrical parameter and a value in the look-up table.
20. The system of claim 19 , wherein the sensor comprises a diode and the electrical parameter is current through the diode.
21. The system of claim 19 , wherein the sensor comprises a diode and the electrical parameter is voltage across the diode.
22. The system of claim 21 , wherein the temperature sensor is coupled between the common node and a second reference voltage.
23. The system of claim 10 , wherein the first and second reference voltages are the same.
24. The system of claim 23 , wherein the first and second reference voltages are ground.
25. A method for identifying an integrated circuit and determining its temperature a temperature of the integrated circuit, the method comprising:
using an identification circuit of the integrated circuit to identify the integrated device; and
using a temperature sensor of the integrated circuit to determine the temperature of the integrated circuit;
wherein light is blocked from at least the temperature sensor to prevent photocurrent generation therein,
operating the identification circuit to identify the integrated circuit while simultaneously not operating the temperature sensor, and
operating the temperature sensor to determine the temperature of the integrated circuit while simultaneously not operating the identification circuit; wherein operating the identification circuit and the temperature sensor using different polarity signal.
26. The method of claim 25 , wherein the device-identification circuit comprises a resistor connected to a diode-connected transistor.
27. The method of claim 26 , further comprising determining a resistance value of the resistor included in the device-identification circuit, the integrated circuit being identified based on the determined resistance value.
28. The method of claim 25 , wherein the temperature sensor is a diode connected in parallel with the device-identification circuit.
29. The method of claim 28 , wherein the device-identification circuit and the temperature sensor diode are connected to a common node, the method further comprising applying a first voltage to the common node to place (i) the device identification circuit in an ON state to identify the integrated circuit and (ii) the temperature sensor diode in an OFF state.
30. The method of claim 25 , further comprising applying a second voltage to the common node to place (i) the device-identification circuit in an OFF state and (ii) the temperature sensor diode in an ON state to determine a temperature of the integrated circuit.
31. The method of claim 25 , wherein temperature is measured by measuring an electrical parameter of the temperature sensor, comparing the measured parameter against a plurality of parameter values associated with known temperatures, and determining the temperature of the integrated circuit based on the comparison.
32. The method of claim 31 , wherein the temperature sensor comprises a diode and the electrical parameter is current through the diode.
33. The method of claim 31 , wherein the temperature sensor comprises a diode and the electrical parameter is voltage across the diode.
34. The method of claim 25 wherein the device-identification circuit and the temperature sensor are connected in parallel.