Asymmetric FET including sloped threshold voltage adjusting material layer and method of fabricating same
View Patent ↗A method of forming a semiconductor structure is provided. The method includes providing a structure including at least one dummy gate region located on a surface of a semiconductor substrate and a dielectric material layer located on sidewalls of the at least one dummy gate region. Next, a portion of the dummy gate region is removed exposing an underlying high k gate dielectric. A sloped threshold voltage adjusting material layer is then formed on an upper surface of the high k gate dielectric, and thereafter a gate conductor is formed atop the sloped threshold voltage adjusting material layer.
1. A method of forming a semiconductor structure comprising:
providing a structure including at least one dummy gate region located on a surface of a semiconductor substrate and a dielectric material layer located on sidewalls of the at least one dummy gate region;
removing a portion of the dummy gate region exposing an underlying high k gate dielectric;
forming a sloped threshold voltage adjusting material layer on an upper surface of the high k gate dielectric, wherein said forming the sloped threshold voltage material layer comprises a line of sight deposition process in which the deposition is performed at an angle that is tilted with respect to the surface of the semiconductor substrate; and
forming a gate conductor atop said sloped threshold voltage adjusting material layer.
2. The method of claim 1 wherein said providing the structure includes a replacement gate process.
3. The method of claim 2 wherein said at least one dummy gate region is formed after forming said dielectric material layer.
4. The method of claim 2 wherein said at least one dummy gate region is formed prior to forming said dielectric material layer.
5. The method of claim 1 wherein said at least one dummy gate region comprises, from bottom to top, said high k gate dielectric and a dummy gate.
6. The method of claim 5 wherein said at least one dummy gate region further includes a chemox layer located between the semiconductor substrate and the high k gate dielectric.
7. The method of claim 5 wherein said at least one dummy gate region further includes a hard mask located atop the dummy gate.
8. The method of claim 1 further comprising forming a source region and a drain region within said semiconductor substrate prior to providing the structure including the at least one dummy gate region and said dielectric material layer.
9. The method of claim 1 further comprising forming a source region and a drain region within said semiconductor substrate prior to providing said dielectric material layer, but after forming said at least one dummy gate region.
10. The method of claim 1 wherein said removing the portion of the at least one dummy gate region includes an etching process that selectively removes at least a dummy gate of said at least one dummy gate region.
11. The method of claim 1 wherein said angle of tilt is from 15° up to, but not including, 90°.
12. The method of claim 1 wherein said line of sight deposition process comprises sputtering, molecular beam epitaxy, physical vapor deposition, or electron-beam enhanced deposition.
13. The method of claim 1 wherein said forming the sloped threshold voltage adjusting material layer includes selecting a pFET threshold voltage adjusting material.
14. The method of claim 1 wherein said forming the sloped threshold voltage adjusting material layer includes selecting an nFET threshold voltage adjusting material.
15. The method of claim 1 wherein one of said at least one dummy gate region is present in a pFET device region of said semiconductor substrate and another of said at least one dummy gate region is present in an nFET device region, and wherein a sloped pFET threshold voltage adjusting material is formed in said pFET device region, and wherein a sloped nFET threshold voltage adjusting material is formed in said nFET device region.
16. A method of forming a semiconductor structure comprising:
forming, in any order, at least one dummy gate region located on a surface of a semiconductor substrate and a dielectric material layer located on sidewalls of the at least one dummy gate region;
removing at least a dummy gate portion of the dummy gate region exposing an underlying high k gate dielectric;
forming a sloped threshold voltage adjusting material layer on an upper surface of the high k gate dielectric, wherein said forming said sloped threshold voltage adjusting material layer comprises a line of sight deposition process in which the deposition is performed at an angle that is tilted from 15° up to, but not including, 90° with respect to the surface of the semiconductor substrate; and
forming a gate conductor atop said sloped threshold voltage adjusting material layer.
17. The method of claim 16 wherein said line of sight deposition process comprises sputtering, molecular beam epitaxy, physical vapor deposition, or electron-beam enhanced deposition.
18. The method of claim 16 wherein said forming the sloped threshold voltage adjusting material layer includes selecting a pFET threshold voltage adjusting material.
19. The method of claim 16 wherein said forming the sloped threshold voltage adjusting material layer includes selecting an nFET threshold voltage adjusting material.