Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a mounting region; applying a mounting structure in the mounting region; mounting an integrated circuit die on the mounting structure; forming an encapsulation on the integrated circuit die and having an encapsulation cavity, the encapsulation cavity shaped by the mounting structure; forming a lead having a lead protrusion from the leadframe, the lead protrusion below a horizontal plane of the integrated circuit die; and removing the mounting structure for exposing the integrated circuit die.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a leadframe having a mounting region;
applying a mounting structure in the mounting region;
mounting an integrated circuit die on the mounting structure;
forming an encapsulation on the integrated circuit die and having an encapsulation cavity, the encapsulation cavity shaped by the mounting structure;
forming a lead having a lead protrusion from the leadframe, the lead protrusion below a horizontal plane of a bottom of the integrated circuit die; and
completely removing the mounting structure for exposing the bottom of the integrated circuit die.
2. The method as claimed in claim 1 wherein forming the encapsulation includes forming the encapsulation cavity having a cavity horizontal dimension larger than a die horizontal dimension of the integrated circuit die.
3. The method as claimed in claim 1 wherein forming the encapsulation includes forming the encapsulation cavity having the lead protrusion extend to the encapsulation cavity.
4. The method as claimed in claim 1 further comprising:
providing a base substrate;
mounting a base integrated circuit to the base substrate; and
mounting the base substrate to the lead with the base integrated circuit in the encapsulation cavity and the integrated circuit die over the base integrated circuit.
5. The method as claimed in claim 1 wherein:
providing the leadframe includes providing the leadframe having a leadframe hole at the mounting region; and
further comprising:
applying a lead tape to a leadframe bottom side of the leadframe; and
removing the lead tape for exposing the mounting structure.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a leadframe having a mounting region and plating a lead;
applying a mounting structure in the mounting region;
mounting an integrated circuit die on the mounting structure;
forming an encapsulation on the integrated circuit die and having an encapsulation cavity, the encapsulation cavity shaped by the mounting structure;
forming the lead having a lead protrusion from the leadframe, the lead protrusion below a horizontal plane of a bottom of the integrated circuit die; and
completely removing the mounting structure for exposing the bottom of the integrated circuit die.
7. The method as claimed in claim 6 wherein forming the lead includes forming the lead partially in the encapsulation with only a portion of the lead at a lead bottom side exposed from the encapsulation.
8. The method as claimed in claim 6 wherein forming the encapsulation includes forming the encapsulation cavity bounded by a cavity sidewall, the cavity sidewall is orthogonal to the horizontal plane of the integrated circuit die.
9. The method as claimed in claim 6 further comprising connecting a chip interconnect between the integrated circuit die and the lead.
10. The method as claimed in claim 6 wherein:
providing the leadframe includes providing a thin leadframe layer for mounting the mounting structure thereon; and
further comprising:
removing the thin leadframe layer with an etching process.