Flexible fiber to wafer interface
An interface device includes a flexible substrate portion, a flexible cladding portion arranged on the substrate portion, a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material, a first engagement feature operative to engage a portion of a wafer, and a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule.
1. An interface device comprising:
a flexible substrate portion;
a flexible cladding portion arranged on the substrate portion;
a flexible single-mode waveguide portion arranged on the cladding portion including a substantially optically transparent material;
a connector portion engaging a first distal end of the flexible substrate portion, the connector portion operative to engage a portion of an optical fiber ferrule; and
a first engagement feature at a second distal end of the flexible substrate operative to engage a portion of a wafer.
2. The device of claim 1 , wherein the wafer includes a second engagement feature operative to engage a portion of the connector portion.
3. The device of claim 1 , further comprising an adhesive material disposed between the interface device and a portion of the wafer.
4. The device of claim 3 , wherein the adhesive material is substantially optically transparent.
5. The device of claim 1 , wherein the first distal end of the flexible substrate portion includes an engagement feature configured to engage a corresponding engagement feature of the connector portion.
6. The device of claim 1 , wherein the optical fiber ferrule includes an MT Ferrule.
7. The device of claim 1 , wherein the substantially optically transparent material of the single-mode waveguide portion includes a polymer material.
8. The device of claim 1 , wherein the single-mode waveguide portion and the cladding portion are arranged on a substantially planar surface of the flexible substrate portion.
9. The device of claim 1 , wherein the waveguide portion includes a plurality of waveguides and the pitch of the waveguides varies within the device portion.
10. The device of claim 9 , wherein the pitch is larger at the first distal end of the flexible substrate portion adjacent to the connector portion than a pitch at the opposing second distal end.
11. The device of claim 9 , wherein the first engagement feature extends outwardly from the flexible substrate portion.
12. The device of claim 9 , wherein the flexible cladding portion includes a polymer material.
13. The device of claim 9 , wherein the flexible substrate portion substantially transparent for wavelengths between approximately 350 nm and 400 nm.
14. A method for fabricating an interface device, the method comprising:
forming a flexible waveguide on a flexible substrate;
securing a first distal end of the flexible substrate to a connector portion;
securing a second distal end of the flexible substrate to a wafer with an optically transparent adhesive such that the flexible waveguide is aligned to define an optical coupling between the flexible waveguide and a waveguide portion of the wafer, wherein securing the second distal end to the wafer further comprises engaging a portion of the wafer with a first engagement feature at the second distal end of the flexible substrate.