System and method for LED packaging
View Patent ↗System and method for LED packaging. The present invention is directed to optical devices. More specifically, embodiments of the presentation provide LED packaging having one or more reflector surfaces. In certain embodiments, the present invention provides LED packages that include thermal pad structures for dissipating heat generated by LED devices. In particular, thermal pad structures with large surface areas are used to allow heat to transfer. In certain embodiments, thick thermally conductive material is used to improve overall thermal conductivity of an LED package, thereby allowing heat generated by LED devices to dissipate quickly. Depending on the application, thermal pad structure, thick thermal conductive layer, and reflective surface may be individually adapted in LED packages or used in combinations. There are other embodiments as well.
1. An optical device comprising:
an electrically insulating substrate defining an opening, the opening having an interior surface;
a conductive layer overlying a portion of the interior surface, a portion of the conductive layer being characterized by a thickness of at least 15 μm;
an LED device electrically coupled to the portion of the conductive layer;
a layer of insulating material overlying the interior surface and the conductive layer; and
a reflective layer overlying the layer of insulating material, wherein the reflective layer comprises an opening for a bond pad.
2. The device of claim 1 wherein the device is characterized by a thermal resistance of less than 10° C./W.
3. The device of claim 1 wherein a portion of the substrate positioned below the conductive layer is characterized by a thickness of at least 120 μm.
4. The device of claim 1 wherein the reflective layer comprises a metal.
5. The device of claim 1 wherein the insulating material comprises titanium oxide.
6. The device of claim 1 wherein the insulating material comprises silicon oxide.
7. The device of claim 1 comprising a thermal pad coupled to the interior surface.
8. The device of claim 1 wherein the conductive layer is characterized by a thickness of at least 25 μm.
9. The device of claim 1 wherein the insulating material comprises a dielectric material.
10. The device of claim 1 wherein the conductive layer comprises copper.
11. The device of claim 1 wherein the interior surface comprises a flat surface.
12. The device of claim 11 wherein the reflective layer overlies at least a portion of the flat surface.
13. The device of claim 12 wherein the reflective layer comprises a metal.
14. The device of claim 1 comprising a bond pad positioned within the opening defined by the reflective layer.
15. The device of claim 1 wherein the conductive layer comprises a first conductive region and a second conductive region and an insulation region between the first conductive region and the second conductive region, wherein the insulation region comprises titanium oxide.
16. The device of claim 1 wherein the conductive layer comprises a first conductive region and a second conductive region and an insulation region between the first conductive region and the second conductive region, wherein the insulation region comprises silicon oxide.
17. An optical device comprising:
an electrically insulating substrate having a top side and a bottom side opposing the top side, wherein the top side defines an opening having an interior surface;
a top conductive layer overlying a portion of the interior surface, a portion of the top conductive layer having a thickness of at least 15 μm;
a bottom conductive layer overlying and contacting a portion of the bottom side of the substrate;
an LED device electrically coupled to the top conductive layer; and
a reflective layer overlying the top conductive layer, wherein the reflective layer comprises an opening for a bond pad.
18. The optical device of claim 17 comprising an insulating layer positioned between the top conductive layer and the reflective layer.
19. The device of claim 17 wherein the device is characterized by a thermal resistance of less than 10° C./W.
20. The device of claim 17 wherein a portion of the substrate positioned below the first conductive region is characterized by a thickness of at least 120 μm.
21. The device of claim 17 comprising an insulating layer overlying at least a portion of the interior surface.
22. The device of claim 21 wherein the insulating layer comprises titanium oxide.
23. The device of claim 17 wherein the interior surface comprises a flat surface.
24. The device of claim 23 wherein the reflective layer overlies at least a portion of the flat surface.
25. The device of claim 17 wherein the reflective layer comprises a metal.
26. The device of claim 17 comprising a bond pad positioned within the opening defined by the reflective layer.