Exposed die overmolded flip chip package
View Patent ↗An exposed die overmolded flip chip package includes a substrate. A die is flip chip mounted to an upper surface of the substrate. The package further includes a mold cap filling a space between an active surface of the die and the upper surface of the substrate. The mold cap includes a principal surface, sidewalls extending from the upper surface of the substrate to the principal surface, an annular surface coplanar with the inactive surface of the die and extending outward from a peripheral edge of the inactive surface of the die, and protruding surfaces extending between the principal surface and the annular surface. The mold cap does not cover the inactive surface of the die such that heat transfer from the die to the ambient environment is maximized and the package thickness is minimized.
1. An exposed die overmolded flip chip package comprising:
a substrate comprising a first surface;
a die flip chip mounted to the first surface of the substrate, the die comprising:
an active surface;
an inactive surface opposite the active surface; and
bond pads on the active surface;
a mold cap, the inactive surface of the die being exposed from the mold cap, wherein the mold cap comprises:
a principal surface;
receding surfaces extending from the principal surface towards the substrate; and
an annular surface coplanar with the inactive surface of the die; and
electrically conductive vias extending through the mold cap, the vias extending from the substrate to the principal surface.
2. The exposed die overmolded flip chip package of claim 1 wherein the mold cap further comprises sidewalls extending from the first surface of the substrate to the principal surface of the mold cap.
3. The exposed die overmolded flip chip package of claim 2 wherein the principal surface extends inwards from the sidewalls to the receding surfaces.
4. The exposed die overmolded flip chip package of claim 1 wherein the receding surfaces extend between the principal surface and the annular surface.
5. An exposed die overmolded flip chip package comprising:
a substrate comprising a first surface;
a die flip chip mounted to the first surface of the substrate, the die comprising:
an active surface;
an inactive surface opposite the active surface; and
bond pads on the active surface;
a mold cap, the inactive surface of the die being exposed from the mold cap, wherein the mold cap comprises:
a principal surface; and
receding surfaces extending from the principal surface towards the substrate, the receding surfaces extending directly on to the inactive surface of the die; and
electrically conductive vias extending through the mold cap, the vias extending from the substrate to the principal surface.
6. The exposed die overmolded flip chip package of claim 1 wherein the substrate comprises first traces on the first surface of the substrate electrically connected to the vias.
7. The exposed die overmolded flip chip package of claim 1 further comprising interconnection balls on the vias.
8. The exposed die overmolded flip chip package of claim 1 further comprising openings within the mold cap, the vias comprising electrically conductive material within the openings.
9. The exposed die overmolded flip chip package of claim 8 wherein the openings are formed using laser ablation.
10. An exposed dies overmolded flip chip package comprising:
a substrate comprising a first surface;
a die flip chip mounted to the first surface of the substrate, the die comprising:
an active surface;
an inactive surface opposite the active surface; and
bond pads on the active surface;
a mold cap comprising a principal surface at a greater height from the first surface of the substrate than the inactive surface of the die, the inactive surface of the die being exposed from the mold cap; and
electrically conductive vias extending through the mold cap.
11. The exposed die overmolded flip chip package of claim 10 wherein the mold cap further comprises receding surfaces extending from the principal surface towards the substrate.
12. The exposed die overmolded flip chip package of claim 11 wherein the mold cap further comprises an annular surface coplanar with the inactive surface of the die, the receding surfaces extending between the principal surface and the annular surface.
13. The exposed die overmolded flip chip package of claim 10 wherein the entire inactive surface of the die is exposed from the mold cap.
14. An exposed die overmolded flip chip package comprising:
a substrate comprising a first surface;
a die flip chip mounted to the first surface of the substrate, the die comprising:
an active surface;
an inactive surface opposite the active surface; and
bond pads on the active surface;
a mold cap comprising a principal surface at a greater height from the first surface of the substrate than the inactive surface of the die, a central region of the inactive surface of the die being exposed from the mold cap; and
electrically conductive vias extending through the mold cap.
15. The exposed die overmolded flip chip package of claim 14 wherein a periphery of the inactive surface of the die is enclosed within the mold cap.
16. The exposed die overmolded flip chip package of claim 14 wherein the mold cap further comprises receding surfaces extending from the principal surface towards the substrate.
17. The exposed die overmolded flip chip package of claim 16 wherein the receding surfaces extend directly on to the inactive surface of the die.