Patent Assignment
Reel/Frame 066137/0326
Assignment of Assignor's Interest
Recorded: 2024-01-16
Pages: 10
Assignors
DARVEAUX, ROBERT FRANCIS
Executed: 2006-11-01
BARROW, MICHAEL
Executed: 2006-11-01
JIMAREZ, MIGUEL ANGEL
Executed: 2006-11-01
KIM, JAE DONG
Executed: 2006-10-31
PARK, DAE KEUN
Executed: 2006-10-31
LEE, KI WOOK
Executed: 2006-10-31
YOON, JU HOON
Executed: 2006-11-01
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248-1604
Covered Properties
(5)
Exposed Die Overmolded Flip Chip Package Method
Patent:
8,207,022 →
Application:
12/931,326 →
Exposed Die Overmolded Flip Chip Package
Patent:
8,368,194 →
Application:
13/487,713 →
Exposed Die Overmolded Flip Chip Package and Fabrication Method
Patent:
8,476,748 →
Application:
13/665,295 →
Exposed Die Overmolded Flip Chip Package and Fabrication Method
Patent:
8,541,260 →
Application:
13/864,750 →
Exposed Die Overmolded Flip Chip Package and Fabrication Method
Patent:
8,847,372 →
Application:
13/972,292 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →