Integrated circuit packaging system with tiebar-less design and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a tiebar-less lead frame having:

a die attach pad having a pad-recess on a bottom side of the die attach pad,

a connector portion integrally connected to the die attach pad,

a lead integrally connected to the connector portion and having a lead-recess on a bottom side of the lead;

attaching an integrated circuit die to the die attach pad;

attaching an internal interconnect to the integrated circuit die and the lead;

forming an encapsulation over the integrated circuit die, with the encapsulation filling the pad-recess and the lead-recess;

removing the connector portion to separate the die attach pad and the lead; and

covering the die attach pad and the lead with an isolation cover.

2. The method as claimed in claim 1 further comprising:

forming a pad-overhang portion on the die attach pad between the pad-recess and the lead; and

forming a lead-overhang portion on the lead between the lead and the die attach pad.

3. The method as claimed in claim 1 wherein:

providing the tiebar-less lead frame includes providing the tiebar-less lead frame having a regular pattern of a pitch between consecutive pairs of the lead along a peripheral side; and

further comprising:

forming a contiguous upper surface from a top portion of the encapsulation down to a top portion of the lead.

4. The method as claimed in claim 1 wherein providing the tiebar-less lead frame includes providing the tiebar-less lead frame having the die attach pad not connected to a tie bar.

5. The method as claimed in claim 1 wherein providing the tiebar-less lead frame includes providing the tiebar-less lead frame having a vertical thickness and the pad-recess having a pad-recess depth greater than half of the vertical thickness, and the lead-recess having a lead-recess depth greater than half of the vertical thickness.

6. An integrated circuit packaging system comprising:

a die attach pad, the die attach pad includes a pad-recess on a bottom side of the die attach pad;

a lead adjacent to the die attach pad, the lead includes a lead-recess on a bottom side of the lead;

an integrated circuit die attached to the die attach pad and connected to the lead with an internal interconnect;

an encapsulation over the integrated circuit die, the encapsulation fills the pad-recess and the lead-recess; and

an isolation cover between the die attach pad and the lead.

7. The system as claimed in claim 6 wherein the isolation cover is a mold filler.

8. The system as claimed in claim 6 wherein the isolation cover is a coating layer.

9. The system as claimed in claim 6 wherein the encapsulation includes a sloped peripheral wall along a perimeter portion of the encapsulation.

10. The system as claimed in claim 6 wherein:

the encapsulation includes a vertical encapsulation-wall along a perimeter portion of the encapsulation; and

the lead includes a vertical lead-wall on a peripheral side of the lead, with the vertical lead-wall coplanar with the vertical encapsulation-wall.

11. The system as claimed in claim 6 wherein:

the die attach pad includes a pad-overhang portion between the pad-recess and the lead; and

the lead includes a lead-overhang portion between the lead and the die attach pad.

12. An integrated circuit packaging system comprising:

a die attach pad, the die attach pad includes a pad-recess on a bottom side of the die attach pad;

a plurality of leads, including a first lead adjacent to the die attach pad, the first lead having a lead-recess on a bottom side of the first lead, the plurality of leads having a regular pattern of a pitch between consecutive pairs of the plurality of leads along a peripheral side;

an intergrated circuit die attached to the die attached and connected to the first lead with an internal interconnect;

an encapsulation over the integrated circuit die, the encapsulation fills the pad-recess and the lead-recess, the encapsulation includes a contiguous upper surface from a top portion of the encapsulation down to a top portion of the plurality of leads; and

an isolation cover between the die attach pad and the first lead.

13. The system as claimed in claim 6 wherein die attach pad is not connected to a tie bar.

14. The system as claimed in claim 6 wherein:

the lead includes a vertical thickness and the lead-recess having a lead-recess depth greater than half of the vertical thickness; and

the pad-recess having a pad-recess depth greater than half of the vertical thickness.

15. The system as claimed in claim 12 wherein the isolation cover is a mold filler or a coating layer.

16. The system as claimed in claim 12 wherein the encapsulation includes a sloped peripheral wall along a perimeter portion of the encapsulation.

17. The system as claimed in claim 12 wherein:

the encapsulation includes a vertical encapsulation-wall along a perimeter portion of the encapsulation; and

the first lead includes a vertical lead-wall on a peripheral side of the first lead, with the vertical lead-wall coplanar with the vertical encapsulation-wall.

18. The system as claimed in claim 12 wherein:

the die attach pad includes a pad-overhang portion between the pad-recess and the first lead; and

the first lead includes a lead-overhang portion between the first lead and the die attach pad.

19. The system as claimed in claim 12 wherein die attach pad is not connected to a tie bar.

20. The system as claimed in claim 12 wherein:

the first lead includes a vertical thickness and the lead-recess having a lead-recess depth greater than half of the vertical thickness; and

the pad-recess having a pad-recess depth greater than half of the vertical thickness.