Semiconductor device with epitaxial source/drain facetting provided at the gate edge

1. A method of forming a semiconductor structure comprising:

providing an active layer;

forming adjacent gate structures on the active layer, wherein the adjacent gate structures each have sidewalls;

forming first spacers on the sidewalls of the adjacent gate structures;

epitaxially growing a raised region on the active layer between the adjacent gate structures;

forming at least one trench that extends through the raised region and through the active region, whereby the at least one trench separates the raised region into a first raised region corresponding to a first transistor and a second raised region corresponding to a second transistor, the at least one trench separating the first and the second raised region prior to a silicide formation process that forms both a first silicide area over the first raised region and a second silicide area over the second raised region, the first silicide area extending between a first controllably formed facet located adjacent one of the adjacent gate structures and a first substantially vertical side wall adjacent the at least one trench, the second silicide area extending between a second controllably formed facet located adjacent another one of the adjacent gate structures and a second substantially vertical side wall adjacent the at least one trench, wherein the first and the second substantially vertical side walls create respective extended surface areas for the silicide formation process relative to forming the first and the second raised region following the formation of the at least one trench;

forming second spacers within the at least one trench, wherein vertical sides of the second spacers contact a sidewall of the first and second silicide areas, wherein the first raised region and second raised region are electrically isolated by the at least one trench.

2. The method of claim 1 , wherein edges of the raised region embody facet faces.

3. The method of claim 2 , further comprising forming third spacers over the first spacers wherein the third spacers cover the facet faces.

4. The method of claim 1 , wherein the active region is formed from an extremely thin silicon-on-insulator layer.

5. The method of claim 4 , wherein the extremely thin silicon-on-insulator (ETSOI) layer comprises a thickness of about 6-10 nm.

6. The method of claim 5 , wherein the ETSOI layer is formed over a buried oxide (BOX) layer located on a substrate.

7. The method of claim 6 , wherein the forming the at least one trench comprises:

etching areas of the active layer to separate the epitaxially grown raised region into at least two isolated regions and remove the ETSOI layer down to at least an upper surface of the BOX layer.

8. The method of claim 2 , wherein the facet faces reduce parasitic capacitance between the raised region and the adjacent gate structures.

9. The method of claim 1 , wherein the first transistor comprises an nFET device and the second transistor comprises a pFET device.

10. The method of claim 2 , wherein the facet faces are formed by 111 crystal planes.

11. The method of claim 2 , wherein the facet faces are formed by one of 113 crystal planes and 115 crystal planes.

12. The method of claim 1 , wherein the first spacers electrically isolate the gate structures from the raised region.