Programmable memory elements, devices and methods having physically localized structure
A programmable memory element can include an insulating layer formed over a bottom structure; an opening formed in the insulating layer; a sidewall structure formed next to side surfaces of the opening; a tapered structure formed within the opening adjacent to the sidewall structure; and a solid electrolyte forming at least a portion of a structure selected from: the bottom structure, the sidewall structure, and the tapered structure.
1. A programmable memory element, having at least one localized element structure, comprising:
at least an anode electrode, solid electrolyte, and cathode electrode aligned with one another along a substantially vertical axis; wherein
at least one of the electrodes includes a tapered structure having a wide portion that tapers to a narrow portion in the vertical axis direction, and
the anode electrode is formed from at least one element oxidizable to ion conduct in the solid electrolyte; wherein the tapered structure forms at least part of the anode electrode and is formed within an opening having a sidewall structure formed thereon,
the solid electrolyte is formed below the opening, and
the cathode electrode is formed below the solid electrolyte.
2. The programmable memory element of claim 1 , wherein:
the tapered structure is formed within an opening having a sidewall structure formed thereon, the sidewall structure comprises a different material than the tapered structure.
3. The programmable memory element of claim 1 , wherein:
the solid electrolyte is selected from: a chalcogenide and a metal oxide.
4. The programmable memory element of claim 1 , further including:
the tapered structure comprises at least a portion of the anode electrode and is separated from the solid electrolyte by a void region; wherein
a conductive path through the void region is formed and dissolved by application of electric fields.