IP Library Granted Patent US 8,971,100
Granted Patent B2
US 8,971,100 · App. 13/546,169 · Granted Mar 3, 2015

Initialization method of a perpendicular magnetic random access memory (MRAM) device

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Quick Facts
Patent No.
US 8,971,100
App. No.
13/546,169
Granted
Mar 3, 2015
Kind
B2
Abstract

Methods using a sequence of externally generated magnetic fields to initialize the magnetization directions of each of the layers in perpendicular MTJ MRAM elements for data and reference bits when the required magnetization directions are anti-parallel are described. The coercivity of the fixed pinned and reference layers can be made unequal so that one of them can be switched by a magnetic field that will reliably leave the other one unswitched. Embodiments of the invention utilize the different effective coercivity fields of the pinned, reference and free layers to selectively switch the magnetization directions using a sequence of magnetic fields of decreasing strength. Optionally the chip or wafer can be heated to reduce the required field magnitude. It is possible that the first magnetic field in the sequence can be applied during an annealing step in the MRAM manufacture process.

Claims (17)

1. A method for initializing perpendicular magnetization directions of magnetic layers in a set of MRAM elements with each element having at least one free layer and at least first and second fixed layers, the first and second fixed layers having different coercivities, the set of MRAM elements including at least one element that serves as a reference element, the method comprising:

applying a first externally generated magnetic field to the set of MRAM elements, the first externally generated magnetic field having a first field direction and having a first field magnitude sufficient to switch magnetization directions of the free layer and the fixed layers of each element into a first perpendicular magnetization direction; and

after the first externally generated magnetic field has been removed, applying a second externally generated magnetic field to the set of MRAM elements, the second externally generated magnetic field having a second field direction opposite to the first magnetic field and having a second field magnitude that is weaker than the first field magnitude, the second field magnitude being sufficient to switch the magnetization directions of the free layer and the first fixed layer into a second perpendicular magnetization direction while leaving the second fixed layer in the first perpendicular magnetization direction.

2. The method of claim 1 further comprising after the second externally generated magnetic field has been removed, applying a third externally generated magnetic field to the set of MRAM elements, the third externally generated magnetic field having the first field direction opposite to the second field direction and having a third field magnitude that is weaker than the second field magnitude, the third field magnitude being sufficient to switch the magnetization direction of the free layer while leaving the magnetization directions of the first and second fixed layers unchanged.

3. The method of claim 1 wherein applying the first externally generated magnetic field occurs when the set of MRAM elements has been heated to an elevated temperature.

4. The method of claim 1 wherein applying the first externally generated magnetic field further comprises heating the set of MRAM elements to an elevated temperature to lower the coercivities of the first and second fixed layers.

5. The method of claim 1 wherein applying the first externally generated magnetic field occurs when the set of MRAM elements has been heated to an elevated temperature during an manufacturing process is an annealing process.

6. The method of claim 1 wherein the first fixed layer is a pinned layer and the second fixed layer is a reference layer.

7. The method of claim 1 wherein the first fixed layer is a reference layer and the second fixed layer is a pinned layer.

8. The method of claim 1 wherein the free layer and a junction layer in each element are disposed between the first and second fixed layers.

9. The method of claim 1 wherein the first and second fixed layers are disposed adjacent to a spacer layer.

10. The method of claim 1 wherein the first perpendicular magnetization direction and the second perpendicular magnetization direction are substantially opposite to each other.

11. A method for initializing perpendicular magnetization directions of magnetic layers in a set of MRAM elements with each element having at least one free layer and at least first and second fixed layers, the first and second fixed layers having different coercivities, the method comprising:

applying a first externally generated magnetic field to the set of MRAM elements, the first externally generated magnetic field having a first field direction and having a first field magnitude sufficient to switch magnetization directions of the free layer and the fixed layers of each element into a first perpendicular magnetization direction; and

after the first externally generated magnetic field has been removed, applying a second externally generated magnetic field to the set of MRAM elements, the second externally generated magnetic field having a second field direction opposite to the first magnetic field and having a second field magnitude that is weaker than the first field magnitude, the second field magnitude being sufficient to switch the magnetization direction of the first fixed layer into a second perpendicular magnetization direction while leaving the second fixed layer in the first perpendicular magnetization direction.

12. The method of claim 11 wherein applying the first externally generated magnetic field occurs when the set of MRAM elements has been heated to an elevated temperature.

13. The method of claim 11 wherein the first perpendicular magnetization direction and the second perpendicular magnetization direction are substantially opposite to each other.

Assignments (7)
SECURITY INTEREST Recorded Mar 18, 2022
From: AVALANCHE TECHNOLOGY, INC.
To: STRUCTURED ALPHA LP
Reel/Frame 059436/0203 →
SECURITY INTEREST Recorded Apr 19, 2021
From: AVALANCHE TECHNOLOGY, INC.
To: STRUCTURED ALPHA LP
Reel/Frame 057213/0050 →
SECURITY INTEREST Recorded Apr 19, 2021
From: AVALANCHE TECHNOLOGY, INC.
To: STRUCTURED ALPHA LP
Reel/Frame 057217/0674 →
SECURITY INTEREST Recorded Jul 8, 2020
From: AVALANCHE TECHNOLOGY, INC.
To: SILICON VALLEY BANK
Reel/Frame 053156/0223 →
SECURITY INTEREST Recorded Feb 13, 2020
From: AVALANCHE TECHNOLOGY, INC.
To: STRUCTURED ALPHA LP
Reel/Frame 051930/0396 →
SECURITY INTEREST Recorded Apr 18, 2017
From: AVALANCHE TECHNOLOGY, INC.
To: STRUCTURED ALPHA LP
Reel/Frame 042273/0813 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 11, 2012
From: ZHOU, YUCHEN; HUAI, YIMING
To: AVALANCHE TECHNOLOGY INC.
Reel/Frame 028527/0694 →