Integrated circuit package system with internal stacking module

1. A method of manufacturing an integrated circuit package system including:

providing an integrated circuit substrate;

forming an internal stacking module coupled to the integrated circuit substrate including:

forming a flexible substrate having a first side and a second side opposite the first side,

coupling a stacking module integrated circuit to the flexible substrate, the stacking module integrated circuit having an inactive side, a lateral sidewall, and an active side,

forming a mold cap on the stacking module integrated circuit and the flexible substrate,

applying an adhesive over the mold cap, and

bending a flexible extension over the stacking module integrated circuit, the adhesive attached between the flexible extension and the mold cap, the flexible extension extending from the flexible substrate, a side of the flexible extension facing the lateral sidewall and the active side;

mounting a chip interconnect to a portion of the second side of the flexible substrate facing the integrated circuit substrate; and

molding a package body on the integrated circuit substrate and the internal stacking module including a portion of the second side encapsulated in the package body and a top surface of the package body coplanar with a portion of the second side of the flexible substrate exposed from the package body.

2. The method as claimed in claim 1 further comprising mounting a first integrated circuit on the integrated circuit substrate and under the internal stacking module.

3. The method as claimed in claim 1 further comprising coupling a discrete component to the flexible substrate.

4. The method as claimed in claim 1 further comprising positioning a conductive shield around the stacking module integrated circuit.

5. The method as claimed in claim 1 further comprising mounting a second stacking module integrated circuit on the second side of the flexible substrate.

6. A method of manufacturing an integrated circuit package system including:

providing an integrated circuit substrate;

forming an internal stacking module coupled to the integrated circuit substrate including:

forming a flexible substrate having a first side and a second side opposite to the first side, the second side including an external component,

coupling a stacking module integrated circuit to the flexible substrate, the stacking module integrated circuit having an inactive side, a lateral sidewall, and an active side,

forming a mold cap on the stacking module integrated circuit and the flexible substrate,

applying an adhesive over mold cap, and

bending a flexible extension over the stacking module integrated circuit, the adhesive attached between the flexible extension and the mold cap, the flexible extension extending from the flexible substrate, a side of the flexible extension facing the lateral sidewall and the active side;

mounting a chip interconnect to a portion of the second side of the flexible substrate facing the integrated circuit substrate; and

molding a package body on the integrated circuit substrate and the internal stacking module including a portion of the second side encapsulated in the package body and a top surface of the package body coplanar with a portion of the second side of the flexible substrate exposed from the package body.

7. The method as claimed in claim 6 further comprising:

mounting a first integrated circuit on the integrated circuit substrate and under the internal stacking module; and

coupling an electrical interconnect between the first integrated circuit and the component contact.

8. The method as claimed in claim 6 further comprising coupling a discrete component to the flexible substrate, the discrete component includes a resistor, a capacitor, an inductor, a voltage regulator, an active device, or a combination thereof.

9. The method as claimed in claim 6 further comprising positioning a conductive shield around the stacking module integrated circuit, the conductive shield forms an electro-magnetic interference shield or a radio frequency shield around the stacking module integrated circuit.

10. The method as claimed in claim 6 further comprising mounting a second stacking module integrated circuit on the second side of the flexible substrate.

11. An integrated circuit package system includes:

an integrated circuit substrate;

an internal stacking module coupled to the integrated circuit substrate includes:

a flexible substrate having a first side and a second side opposite the first side,

a stacking module integrated circuit coupled to the flexible substrate, the stacking module integrated circuit having an inactive side, a lateral sidewall, and an active side,

a mold cap formed on the stacking module integrated circuit and the flexible substrate,

an adhesive applied over the mold cap, and

a flexible extension over the stacking module integrated circuit, the adhesive attached between the flexible extension and the mold cap, the flexible extension extending from the flexible substrate, a side of the flexible extension facing the lateral sidewall and the active side;

a chip interconnect attached to a portion of the second side of the flexible substrate facing the integrated circuit substrate; and

a package body on the integrated circuit substrate and the internal stacking module includes a portion of the second side encapsulated in the package body and a top surface of the package body coplanar with a portion of the second side of the flexible substrate exposed from the package body.

12. The system as claimed in claim 11 further comprising a first integrated circuit mounted on the integrated circuit substrate and under the internal stacking module.

13. The system as claimed in claim 11 further comprising a discrete component coupled to the flexible substrate.

14. The system as claimed in claim 11 further comprising a conductive shield around the stacking module integrated circuit.

15. The system as claimed in claim 11 further comprising a second stacking module integrated circuit mounted on the second side of the flexible substrate.

16. The system as claimed in claim 11 further comprising:

a component contact on the integrated circuit substrate;

a system contact on the integrated circuit substrate; and

an external component contact on the second side of the flexible substrate.

17. The system as claimed in claim 16 further comprising:

a first integrated circuit on the integrated circuit substrate and under the internal stacking module; and

an electrical interconnect between the first integrated circuit and the component contact.

18. The system as claimed in claim 16 further comprising a discrete component coupled to the flexible substrate, the discrete component includes a resistor, a capacitor, an inductor, a voltage regulator, an active device, or a combination thereof.

19. The system as claimed in claim 16 further comprising a conductive shield around the stacking module integrated circuit, the conductive shield includes an electro-magnetic interference shield or a radio frequency shield around the stacking module integrated circuit.

20. The system as claimed in claim 16 further comprising:

a second stacking module integrated circuit on the second side of the flexible substrate; and

an electrical interconnect between the second side of the flexible substrate and the component contact on the integrated circuit substrate.