IP Library Granted Patent US 8,736,924
Granted Patent B2
US 8,736,924 · App. 13/625,246 · Granted May 27, 2014

Time-delay-and-integrate image sensors having variable integration times

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,736,924
App. No.
13/625,246
Granted
May 27, 2014
Kind
B2
Abstract

In various embodiments, a time-delay-and-integrate (TDI) image sensor includes (i) a plurality of integrating CCDs (ICCDs), arranged in parallel, that accumulate photocharge in response to exposure to light, (ii) electrically coupled to the plurality of ICCDs, a readout CCD (RCCD) for receiving photocharge from the plurality of ICCDs, and (iii) electrically coupled to the RCCD, readout circuitry for converting charge received from the RCCD into voltage.

Claims (33)

1. An imaging system comprising:

a time-delay-and-integrate (TDI) image sensor comprising (i) a plurality of integrating CCDs (ICCDs), arranged in parallel, that accumulate photocharge in response to exposure to light, (ii) electrically coupled to the plurality of ICCDs, a readout CCD (RCCD) for receiving photocharge from the plurality of ICCDs, and (iii) electrically coupled to the RCCD, readout circuitry for converting charge received from the RCCD into voltage;

an optical system for receiving light from a scene to be imaged and projecting it on the plurality of ICCDs;

a leading sensor for receiving the light projected from the optical system prior to projection thereof on the plurality of ICCDs, thereby capturing a leading image of the scene; and

a control system for controlling operation of the TDI image sensor based at least in part on at least a portion of the leading image.

2. The imaging system of claim 1 , wherein the optical system is configured to sweep the light from the scene across the leading sensor and the TDI image sensor continuously and sequentially.

3. The imaging system of claim 1 , wherein the leading sensor is configured to collect color information related to the scene.

4. The imaging system of claim 3 , wherein the TDI image sensor is not configured to collect color information related to the scene.

5. The imaging system of claim 1 , further comprising a substrate on which the leading sensor and the TDI image sensor are disposed.

6. The imaging system of claim 1 , wherein a dynamic range of the leading sensor is less than a dynamic range of the TDI image sensor.

7. The imaging system of claim 1 , wherein the control system alters an integration time of at least one of the ICCDs based on a brightness level of at least a portion of the leading image.

8. The imaging system of claim 1 , wherein the TDI image sensor comprises an optical mask disposed between the optical system and the plurality of ICCDs.

9. The imaging system of claim 8 , wherein the optical mask comprises an array of masking elements, and the control system controls the masking elements to mask portions of the ICCDs whereby light collection at such portions is attenuated.

10. The imaging system of claim 8 , wherein the optical mask comprises an array of reflective elements, and the control system controls the reflective elements to selectively reflect portions of the light from the optical system onto the plurality of ICCDs.

11. The imaging system of claim 1 , wherein each ICCD comprises (i) a plurality of independently controllable stages, (ii) a photosensitive channel for containing photocharge, (iii) a drain for removing photocharge from the channel, and (iv) a gate for controlling flow of photocharge from the channel to the drain.

12. The imaging system of claim 11 , further comprising a plurality of clock lines (i) disposed substantially perpendicular to the ICCDs and (ii) each controlling a particular stage common to all of the ICCDs.

13. The imaging system of claim 12 , wherein the control system is configured to reset a selected stage of a selected ICCD by (i) applying a bias to the clock line corresponding to the selected stage and (ii) applying a bias to the gate corresponding to the selected ICCD.

14. The imaging system of claim 1 , wherein each ICCD comprises (i) a plurality of independently controllable stages, (ii) a photosensitive channel for containing photocharge, (iii) a sense node for measuring photocharge received thereby from the channel, and (iv) a gate for controlling flow of photocharge from the channel to the sense node.

15. The imaging system of claim 14 , wherein the control system is configured to (i) measure photocharge received by the sense node from the channel and (ii) reset the sense node by applying a bias thereto to remove photocharge therefrom.

16. The imaging system of claim 14 , wherein the control system is configured to reset a selected stage of the ICCD by applying a bias to the gate to thereby allow photocharge to flow from the channel into the sense node.

17. A method of image capture utilizing a time-delay-and-integrate (TDI) image sensor comprising (i) a plurality of integrating CCDs (ICCDs), arranged in parallel, that accumulate photocharge in response to exposure to light, (ii) electrically coupled to the plurality of ICCDs, a readout CCD (RCCD) for receiving photocharge from the plurality of ICCDs, and (iii) electrically coupled to the RCCD, readout circuitry for converting charge received from the RCCD into voltage, the method comprising:

projecting light received from a scene to be imaged onto a leading sensor, the leading sensor capturing a leading image of the scene;

thereafter, projecting light from the scene onto the plurality of ICCDs to capture a scene image; and

during capture of the scene image, controlling operation of the TDI sensor based at least in part on at least a portion of the leading image.

18. The method of claim 17 , wherein the projection of light onto the leading sensor and onto the plurality of ICCDs are performed continuously and sequentially.

19. The method of claim 17 , wherein the leading image comprises color information.

20. The method of claim 19 , wherein the scene image is substantially free of color information.

21. The method of claim 17 , wherein controlling operation of the TDI sensor comprises altering an integration time of at least one of the ICCDs based on a brightness level of at least a portion of the leading image.

22. The method of claim 17 , wherein controlling operation of the TDI sensor comprises masking portions of the ICCDs whereby light collection at such portions is attenuated.

23. The method of claim 17 , wherein controlling operation of the TDI sensor comprises resetting a selected stage of a selected ICCD.

24. The method of claim 23 , wherein resetting the selected stage comprises transferring photocharge therewithin into a drain associated with the selected ICCD.

25. The method of claim 23 , wherein resetting the selected stage comprises transferring photocharge therewithin into a sense node associated with the selected ICCD.

26. The method of claim 17 , further comprising comparing the leading image with the scene image to detect motion in the scene.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2014
From: TRUESENSE IMAGING, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033460/0457 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 6, 2012
From: COMPTON, JOHN T.; NELSON, EDWARD T.; NICHOLS, DAVID N.
To: TRUESENSE IMAGING, INC.
Reel/Frame 029249/0820 →