Through silicon via wafer, contacts and design structures

1. A method comprising:

forming a contact hole in a dielectric material formed on a substrate;

forming a via in the substrate and through the dielectric material;

lining the contact hole and the dielectric material with a metal liner using a deposition technique that will avoid formation of the liner in the via formed in the substrate; and

filling the contact hole and the via with a metal such that the metal is formed on the liner in the contact hole and directly on the substrate in the via.

2. The method of claim 1 , wherein the metal is tungsten and the filling is formed simultaneously for the contact hole and the via.

3. The method of claim 2 , wherein the liner is a refractory metal.

4. The method of claim 3 , wherein the refractory metal is TiN.

5. The method of claim 3 , wherein the refractory metal is TiW.

6. The method of claim 1 , wherein the contact hole is smaller in width and depth than the via.

7. The method of claim 6 , wherein the deposition technique comprises a metal sputtering process.

8. The method of claim 7 , wherein a ratio of the amount of metal metal in the contact hole to amount of metal in the via within the substrate is 10:1 or greater.

9. The method of claim 1 , wherein the via is formed in a star pattern and the metal is copper.

10. The method of claim 1 , further comprising removing the liner from a top surface of the dielectric material.

11. A method comprising:

forming a contact hole in a dielectric material formed on a substrate;

forming a via in the substrate and through the dielectric material, wherein the via is formed in a star shaped pattern;

lining at least the contact hole with a metal liner; and

filling the contact hole and the via with a metal such that the metal is formed on the liner in the contact hole,

wherein the star shaped pattern of the via comprises a plurality of disjunct legs separated by a minimum spacing.

12. The method of claim 11 , further comprising lining the via with the metal liner and the metal is tungsten.

13. The method of claim 11 , wherein the lining is also formed in the via by a chemical vapor deposition process.

14. The method of claim 11 , wherein:

the star shaped pattern of the via comprises a single leg surrounded by the plurality of disjunct legs, and

the single leg is longer than the disjunct legs and has a width that is smaller than the disjunct legs.

15. The method of claim 11 , wherein the plurality of disjunct legs have substantially a same length and width.

16. The method of claim 1 , wherein;

the liner is a refractory metal;

the contact hole is smaller in width than the via; and

the deposition technique comprises a selective deposition technique.

17. The method of claim 16 , wherein the selective deposition technique is a sputter deposition technique.

18. The method of claim 1 , wherein:

the via comprises a first portion of the via through the dielectric material and a second portion in the substrate; and

the lining using the deposition technique lines the first portion of the via with the metal liner and avoids lining the second portion with the metal liner.

19. The method of claim 1 , wherein the forming the via comprises forming the via in in a star pattern comprised a plurality of disjunct legs.

20. The method of claim 19 , wherein adjacent ones of the each the disjunct legs are separated by a minimum spacing.