Wafer level package and fabrication method
View Patent ↗A method of forming an electronic component package includes coupling a first surface of an electronic component to a first surface of a first dielectric strip, the electronic component comprising bond pads on the first surface; forming first via apertures through the first dielectric strip to expose the bond pads; and filling the first via apertures with an electrically conductive material to form first vias electrically coupled to the bond pads. The bond pads are directly connected to the corresponding first vias without the use of a solder and without the need to form a solder wetting layer on the bond pads.
1. A method of forming an electronic component package comprising:
forming an assembly, the assembly comprising:
an electronic component comprising:
a first surface comprising bond pads thereon;
a second surface opposite the first surface;
an encapsulant encapsulating the electronic component; and
a dielectric strip comprising a first surface coupled to the first surface of the electronic component;
forming via apertures through the dielectric strip to expose the bond pads;
filling the via apertures with an electrically conductive material to form vias electrically coupled to the bond pads; and
coupling a heat sink to the second surface of the electronic component.
2. The method of claim 1 wherein a thermal pad is between the heat sink and the second surface.
3. The method of claim 1 wherein a thermal grease is between the heat sink and the second surface.
4. The method of claim 1 wherein the heat sink is coupled to the second surface with an adhesive.
5. The method of claim 1 wherein the heat sink comprises a copper slug.
6. The method of claim 1 wherein the encapsulant provides rigidity and support for the assembly.
7. The method of claim 1 wherein excess electrically conductive material is formed on a second surface of the dielectric strip.
8. The method of claim 1 further comprising forming traces electrically coupled to the vias.
9. The method of claim 8 wherein the traces are on a second surface of the dielectric strip.
10. The method of claim 8 wherein the vias and the traces are formed at the same time.
11. The method of claim 8 wherein the vias and the traces are formed using a single plating operation.
12. The method of claim 1 wherein the filling the via apertures with an electrically conductive material comprises plating copper or a copper containing material in the via apertures.
13. A method of forming an electronic component package comprising:
coupling a heat sink to an electronic component;
encapsulating the electronic component in an encapsulant, the electronic component comprising a first surface comprising bond pads thereon;
coupling a first surface of a dielectric strip to the first surface of the electronic component;
forming via apertures through the dielectric strip to expose the bond pads; and
forming vias and traces coupled to the dielectric strip, the vias being electrically coupled to the bond pads.
14. The method of claim 13 wherein a thermal pad is between the heat sink and the electronic component.
15. The method of claim 13 wherein a thermal grease is between the heat sink and the electronic component.
16. The method of claim 13 wherein the heat sink is coupled to the electronic component with an adhesive.
17. An electronic component package comprising:
a heat sink coupled to an electronic component;
an encapsulant encapsulating the electronic component, the electronic component comprising a first surface comprising bond pads thereon;
a dielectric strip comprising a first surface coupled to the first surface of the electronic component;
via apertures through the dielectric strip to expose the bond pads; and
vias within the via apertures, the vias being coupled to the bond pads.
18. The electronic component package of claim 17 wherein the encapsulant further encapsulates the heat sink.
19. The electronic component package of claim 18 further comprising an adhesive coupling the heat sink to the electronic component.
20. The electronic component package of claim 18 further comprising a means for enhancing heat transfer from the electronic component to the heat sink between the heat sink and the electronic component.