Patent Assignment
Reel/Frame 066078/0770
Assignment of Assignor's Interest
Recorded: 2024-01-10
Pages: 4
Assignors
HUEMOELLER, RONALD PATRICK
Executed: 2002-11-07
RUSLI, SUKIANTO
Executed: 2002-11-08
RAZU, DAVID
Executed: 2002-11-07
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85248
Covered Properties
(6)
Wafer Level Package Fabrication Method
Patent:
8,119,455 →
Application:
13/065,296 →
Wafer Level Package and Fabrication Method
Patent:
8,298,866 →
Application:
13/358,947 →
Wafer Level Package and Fabrication Method
Patent:
8,486,764 →
Application:
13/627,815 →
Wafer Level Package and Fabrication Method
Patent:
8,691,632 →
Application:
13/918,307 →
Wafer Level Package and Fabrication Method
Patent:
8,710,649 →
Application:
14/019,136 →
Wafer Level Package and Fabrication Method
Patent:
8,952,522 →
Application:
14/264,970 →
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 9, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054067/0135 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →