Using stress reduction barrier sub-layers in a semiconductor die
View Patent ↗A semiconductor die, which includes a substrate, a group of primary conduction sub-layers, and a group of separation sub-layers, is disclosed. The group of primary conduction sub-layers is over the substrate. Each adjacent pair of the group of primary conduction sub-layers is separated by at least one of the group of separation sub-layers. As a result, the group of separation sub-layers mitigates grain growth in the group of primary conduction sub-layers.
1. A semiconductor die comprising:
a substrate;
a metallization layer on the substrate;
a first plurality of primary conduction sub-layers over the substrate;
a first plurality of separation sub-layers, wherein:
at least a corresponding one of the first plurality of separation sub-layers is disposed between each adjacent pair of the first plurality of primary conduction sub-layers; and the first plurality of separation sub-layers is adapted to mitigate grain growth in the first plurality of primary conduction sub-layers and the first plurality of primary conduction sub-layers and the first plurality of separation sub-layers provide a first multiple sub-layer metallization layer on the substrate, wherein the first multiple sub-layer metallization layer is on the metallization layer;
a plurality of epitaxial layers on the metallization layer;
a via that has a portion that is perpendicular to two of the plurality of epitaxial layers, where a portion of the metallization layer along the via traverses between the two of the plurality of epitaxial layers; and
a via membrane on the via where the via membrane comprises a portion of the first multiple sub-layer metallization layer.
2. The semiconductor die of claim 1 wherein each of the first plurality of primary conduction sub-layers comprises gold.
3. The semiconductor die of claim 2 wherein a concentration of gold in each of the first plurality of primary conduction sub-layers exceeds 99 percent.
4. The semiconductor die of claim 1 wherein each of the first plurality of primary conduction sub-layers does not comprise copper.
5. The semiconductor die of claim 1 wherein each of the first plurality of primary conduction sub-layers does not comprise silver.
6. The semiconductor die of claim 1 wherein each of the first plurality of primary conduction sub-layers does not comprise aluminum.
7. The semiconductor die of claim 1 wherein at least one of the first plurality of separation sub-layers comprises nickel.
8. The semiconductor die of claim 1 wherein at least one of the first plurality of separation sub-layers comprises platinum.
9. The semiconductor die of claim 1 wherein at least one of the first plurality of separation sub-layers comprises titanium.
10. The semiconductor die of claim 1 wherein a thickness of each of the first plurality of primary conduction sub-layers is equal to at least ten times a thickness of each of the first plurality of separation sub-layers.
11. The semiconductor die of claim 1 wherein a thickness of each of the first plurality of primary conduction sub-layers is equal to at least twenty times a thickness of each of the first and second pluralities of separation sub-layers.
12. The semiconductor die of claim 1 wherein a thickness of each of the first plurality of primary conduction sub-layers is less than or equal to about 30,000 Angstroms.
13. The semiconductor die of claim 1 wherein a thickness of each of the first plurality of primary conduction sub-layers is less than or equal to about 20,000 Angstroms.
14. The semiconductor die of claim 1 wherein a thickness of each of the first plurality of primary conduction sub-layers is less than or equal to about 10,000 Angstroms.
15. The semiconductor die of claim 1 wherein the substrate comprises silicon carbide.
16. The semiconductor die of claim 1 wherein the first multiple sub-layer metallization layer further comprises:
an adhesion layer; and
a diffusion barrier layer on the adhesion layer, such that the first plurality of primary conduction sub-layers and the first plurality of separation sub-layers are on the diffusion barrier layer.
17. The semiconductor die of claim 16 wherein the adhesion layer comprises titanium.
18. The semiconductor die of claim 16 wherein the adhesion layer comprises nickel.
19. The semiconductor die of claim 16 wherein the diffusion barrier layer comprises platinum.
20. The semiconductor die of claim 16 wherein the diffusion barrier layer comprises nickel.