IP Library Granted Patent US 9,099,983
Granted Patent B2
US 9,099,983 · App. 13/654,718 · Granted Aug 4, 2015

Bulk acoustic wave resonator device comprising a bridge in an acoustic reflector

Inventors: Dariusz Burak (Fort Collins, CO); John Choy (Westminster, CO); Phil Nikkel (Loveland, CO)
Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
H03H9/132H03H9/0211H03H9/02118H03H9/175H03H9/589
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Quick Facts
Patent No.
US 9,099,983
App. No.
13/654,718
Granted
Aug 4, 2015
Kind
B2
Abstract

A bulk acoustic wave (BAW) resonator device includes an acoustic reflector formed over a substrate and a resonator stack formed over the acoustic reflector. The acoustic reflector includes multiple acoustic impedance layers. The resonator stack includes a first electrode formed over the acoustic reflector, a piezoelectric layer formed over the first electrode, and a second electrode formed over the piezoelectric layer. A bridge is formed within one of the acoustic reflector and the resonator stack.

Claims (33)

1. A bulk acoustic wave (BAW) resonator device, comprising:

an acoustic reflector formed over a substrate, the acoustic reflector comprising a plurality of acoustic impedance layers;

a resonator stack formed over the acoustic reflector, the resonator stack comprising a bottom electrode formed over the acoustic reflector, a piezoelectric layer formed over the bottom electrode, and a top electrode formed over the piezoelectric layer;

a first bridge formed in the acoustic reflector; and

a second bridge formed in the resonator stack.

2. The BAW resonator device of claim 1 , wherein the first bridge is formed between adjacent acoustic impedance layers of the acoustic reflector.

3. The BAW resonator device of claim 2 , wherein the first bridge is formed between a first acoustic impedance layer adjacent the bottom electrode and a second acoustic impedance layer formed adjacent the first acoustic impedance layer.

4. The BAW resonator device of claim 3 , wherein the first acoustic impedance layer is formed of a first material having a relatively low acoustic impedance and the second acoustic impedance layer is formed of a second material having a relatively high acoustic impedance.

5. The BAW resonator device of claim 4 , wherein the first material comprises one of silicon oxide (SiO x ) or carbon-doped silicon oxide (CDO), and the second material comprises one of tungsten (W), molybdenum (Mo) or silicon nitride (SiN x ).

6. The BAW resonator device of claim 1 , wherein the acoustic reflector comprises a distributed Bragg reflector (DBR).

7. The BAW resonator device of claim 1 , wherein the first bridge is formed between a first acoustic impedance layer adjacent the bottom electrode and a second acoustic impedance layer formed adjacent the first acoustic impedance layer.

8. The BAW resonator device of claim 7 , wherein the second bridge is formed between the bottom electrode and the piezoelectric layer.

9. The BAW resonator device of claim 1 , wherein the first bridge comprises an unfilled bridge, containing air.

10. The BAW resonator device of claim 1 , wherein the first bridge comprises a filled bridge, containing a dielectric material.

11. The BAW resonator device of claim 10 , wherein the dielectric material comprises one of non-etchable borosilicate glass (NEBSG), carbon doped silicon dioxide (CDO), or silicon carbide (SiC).

12. The BAW resonator device of claim 1 , wherein the first bridge comprises a filled bridge, containing a metal.

13. The BAW resonator device of claim 1 , further comprising:

an active region having a perimeter, at least a portion of which is formed by at least one of the first bridge and the second bridge.

14. The BAW resonator device of claim 13 , wherein the at least a portion of the perimeter of the active region is formed by one of the first bridge and the second bridge extending furthest toward a center of the BAW resonator device.

15. A bulk acoustic wave (BAW) resonator device, comprising:

an acoustic reflector formed over a substrate, the acoustic reflector comprising a plurality of acoustic impedance layers;

a resonator stack formed over the acoustic reflector, the resonator stack comprising a bottom electrode formed over the acoustic reflector, a piezoelectric layer formed over the bottom electrode, and a top electrode formed over the piezoelectric layer; and

a bridge formed within the acoustic reflector, the bridge defining at least part of a perimeter along an active region of the BAW resonator device.

16. The BAW resonator device of claim 15 , further comprising another bridge formed within the resonator stack.

17. The BAW resonator device of claim 15 , further comprising another bridge formed within the acoustic reflector.

18. The BAW resonator device of claim 15 , wherein the plurality of acoustic impedance layers are arranged in pairs, each pair comprising an acoustic impedance layer with a relatively low acoustic impedance and an acoustic impedance layer with a relatively high acoustic impedance, and

wherein the bridge is formed between the acoustic impedance layers of a pair.

19. The BAW resonator device of claim 18 , where the bridge comprises a filled bridge, containing a material different from a material of an acoustic impedance layer of the plurality of acoustic impedance layers in which the bridge material is formed.

20. A bulk acoustic wave (BAW) resonator device, comprising:

a distributed Bragg reflector (DBR) formed over a substrate, the DBR comprising a plurality of acoustic impedance layers;

a resonator stack formed over the DBR, the resonator stack comprising a bottom electrode formed over the DBR, a piezoelectric layer formed over the bottom electrode, and a top electrode formed over the piezoelectric layer;

a first bridge formed between adjacent layers of the plurality of acoustic impedance layers of the DBR; and

a second bridge formed between the piezoelectric layer and one of the bottom electrode and the top electrode of the resonator stack.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047422 FRAME: 0464. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →
MERGER Recorded Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2012
From: BURAK, DARIUSZ; CHOY, JOHN; NIKKEL, PHIL
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 029151/0664 →
Continuity (4)
Continuation In Part 13151631 · Jun 2, 2011
Continuation In Part 13074262 · Mar 29, 2011
Continuation In Part 13036489 · Feb 28, 2011
Related Publication 20130038408A1 · Feb 14, 2013