IP Library Granted Patent US 8,981,218
Granted Patent B1
US 8,981,218 · App. 13/723,079 · Granted Mar 17, 2015

Electronic enclosure with top-facing venting

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Quick Facts
Patent No.
US 8,981,218
App. No.
13/723,079
Granted
Mar 17, 2015
Kind
B1
Abstract

A device includes a first enclosure portion; a second enclosure portion; and a mechanical interface between the first enclosure portion and the second enclosure portion. The mechanical interface may be configured to couple the first enclosure portion to the second enclosure portion to thereby define a housing interior volume. The mechanical interface may be further configured to enable ventilation from the housing interior volume to an exterior of the device.

Claims (24)

1. An enclosure, comprising:

a bottom housing, the bottom housing defining a bottom and a plurality of sides rising from the bottom at an angle therewith to define an inner peripheral surface of the bottom housing;

a top cover configured to couple with the bottom housing to thereby define an inner housing volume, the top cover defining an outer periphery and configured to fit within the inner peripheral surface of the bottom housing to define a peripheral air gap between the outer periphery of the top cover and the inner peripheral surface of the bottom housing.

2. The enclosure of claim 1 , wherein the bottom housing and the top cover are configured such that the peripheral air gap is co-extensive with the inner peripheral surface.

3. The enclosure of claim 1 , wherein the bottom housing and the top cover are configured such that the peripheral air gap is defined adjacent a portion of the inner peripheral surface of the bottom housing.

4. The enclosure of claim 1 , wherein the top cover comprises an overlap surface that extends beyond the inner peripheral surface of the bottom housing.

5. The enclosure of claim 4 , wherein the overlap surface extends to form a side surface of the enclosure when the top cover is coupled to the bottom housing.

6. The enclosure of claim 1 , wherein the peripheral air gap is configured to enable ventilation from the inner housing volume to outside of the enclosure.

7. The enclosure of claim 1 , wherein the bottom housing and the top cover are configured such that the peripheral air gap comprises a plurality of individual air gap sections, each separated by a solid feature of at least one of the top cover and the bottom housing.

8. The enclosure of claim 1 , wherein the bottom housing further comprises a plurality of ventilation posts and wherein the top cover further comprises a plurality of top cover features that are configured to align with and engage the plurality of ventilation posts.

9. The enclosure of claim 8 , wherein the ventilation posts are further configured to support the top cover when the top cover is coupled to the bottom housing.

10. The enclosure of claim 8 , wherein at least one of the ventilation posts is configured as a rib extending from at least one of the plurality of sides.

11. The enclosure of claim 8 , wherein one of the ventilation posts and the top cover features comprises notches and the other one of the ventilation posts and the top cover features comprises tabs, wherein the tabs are configured to align and engage with the notches.

12. The enclosure of claim 11 , wherein the tabs, when engaged with the notches, are configured to be retained within the notches through friction.

13. The enclosure of claim 1 , wherein the bottom housing comprises a first snap-fit structure and wherein the top cover comprises a second snap-fit structure configured to engage and lock with the first snap-fit structure to secure the bottom housing and top cover together.

14. A device, comprising: a first enclosure portion;

a second enclosure portion; and a mechanical interface between the first enclosure portion and the second enclosure portion, the mechanical interface being configured to couple the first enclosure portion to the second enclosure portion to thereby define a housing interior volume, wherein the mechanical interface is further configured to define a gap between the first enclosure portion and the second enclosure portion to enable ventilation from the housing interior volume to an exterior of the device.

15. The device of claim 14 , wherein the mechanical interface is configured to define a gap between the first enclosure portion and the second enclosure portion.

16. The device of claim 15 , wherein the mechanical interface is further configured such that the gap extends at least partially around an outer periphery of the second enclosure portion.

17. The device of claim 16 , wherein the mechanical interface is further configured such that the gap comprises a plurality of individual adjacent gap sections, each separated by a feature of the mechanical interface.

18. The device of claim 14 , wherein the mechanical interface is integral to at least one of the first enclosure portion and the second enclosure portion.

19. The device of claim 14 , wherein the mechanical interface comprises a first portion and a second portion and wherein the first portion of the mechanical interface is integral with the first enclosure portion and the second portion of the mechanical interface is integral with the second enclosure portion.

20. The device of claim 14 , further comprising a printed circuit board disposed within the housing interior volume.

21. The device of claim 14 , wherein the printed circuit board comprises a router.

Assignments (13)
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
RELEASE OF SECURITY INTEREST AT REEL 038744 FRAME 0481 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 058982/0556 →
RELEASE OF SECURITY INTEREST Recorded Mar 5, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 045501/0714 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038744/0481 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 038722/0229 →
SECURITY AGREEMENT Recorded May 17, 2016
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038744/0281 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2012
From: KONO, TAKASHI; CARIKER, BRUCE A.; BOWMAN, MICHAEL J.; PENG, STEVEN T.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 029514/0342 →