IP Library Granted Patent US 8,878,256
Granted Patent B2
US 8,878,256 · App. 13/735,643 · Granted Nov 4, 2014

Image sensors with multiple output structures

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Quick Facts
Patent No.
US 8,878,256
App. No.
13/735,643
Granted
Nov 4, 2014
Kind
B2
Abstract

In various embodiments, image sensors incorporate multiple output structures by including multiple sub-arrays, at least one of which includes a region of active pixels, a dark pixel region that is fanned and/or slanted, a dark pixel region that is unfanned and unslanted, a horizontal CCD, and an output structure for conversion of charge to voltage.

Claims (28)

1. An image sensor comprising:

two or more pixel sub-arrays each comprising at least one output structure for conversion of charge to voltage, at least one of the sub-arrays comprising:

a region of active pixels each comprising (i) a photo-sensitive region (PSR) for converting light into electrical charge and (ii) a vertical channel for transferring charge from the PSR,

electrically and directly connected to and positioned below the region of active pixels, a slanted region of dark pixels each (i) comprising a vertical channel for transferring charge and (ii) shielded from incident light,

electrically and directly connected to and positioned below the slanted region of dark pixels, an unslanted region of dark pixels each (i) comprising a vertical channel for transferring charge and (ii) shielded from incident light,

electrically and directly connected to and positioned below the unslanted region of dark pixels, a horizontal CCD (HCCD), and

electrically connected to the HCCD, an output structure for conversion of charge to voltage,

wherein (i) a direction of charge transfer in the vertical channels within the dark pixels in the slanted region is not parallel to a direction of charge transfer in the vertical channels within the active pixels, and (ii) a direction of charge transfer in the vertical channels within the dark pixels of the unslanted region is substantially parallel to the direction of charge transfer in the vertical channels within the active pixels.

2. The image sensor of claim 1 , wherein the direction of charge transfer in the vertical channels within dark pixels of the slanted region of a first sub-array is different from the direction of charge transfer in the vertical channels within dark pixels of the slanted region of a second sub-array different from the first sub-array.

3. The image sensor of claim 2 , wherein the first sub-array adjoins the second sub-array.

4. The image sensor of claim 1 , wherein, in at least one sub-array, a width of dark pixels in the slanted region is (i) approximately equal to a width of dark pixels in the unslanted region and (ii) approximately equal to a width of active pixels in the region of active pixels.

5. The image sensor of claim 1 , wherein one or more dark pixels in the slanted region comprises a PSR.

6. The image sensor of claim 1 , wherein one or more dark pixels in the unslanted region comprises a PSR.

7. The image sensor of claim 1 , wherein a width of the vertical channel within dark pixels of the slanted region is substantially equal to a width of the vertical channel within dark pixels of the unslanted region.

8. The image sensor of claim 1 , wherein one or more dark pixels in the slanted region lack a PSR.

9. The image sensor of claim 1 , wherein one or more dark pixels in the unslanted region lack a PSR.

10. The image sensor of claim 1 , wherein one or more of the sub-arrays comprises:

a region of active pixels each comprising (i) a PSR and (ii) a vertical channel for transferring charge from the PSR;

electrically connected to the region of active pixels, an unslanted region of dark pixels each (i) comprising a vertical channel for transferring charge and (ii) shielded from incident light;

electrically connected to the unslanted region of dark pixels, an HCCD; and

electrically connected to the HCCD, an output structure for conversion of charge to voltage,

wherein a direction of charge transfer in the vertical channels within the dark pixels in the unslanted region is substantially parallel to the direction of charge transfer in the vertical channels within the active pixels.

11. The image sensor of claim 1 , wherein the output structure of one sub-array is disposed within a gap between two sub-arrays formed by a slanted region of dark pixels within at least one of the two sub-arrays.

12. The image sensor of claim 1 , wherein the output structures of two adjoining sub-arrays are both disposed within a gap between two sub-arrays formed by a slanted region of dark pixels within at least one of the two sub-arrays.

13. The image sensor of claim 1 , wherein the output structure of at least one of the sub-arrays comprises (i) a dummy shift register having a width substantially equal to a width of shift registers in the HCCD, (ii) a charge-carrying region having a width, along at least a portion of its length, smaller than the width of shift registers in the HCCD, (iii) a sense node, and (iv) an amplifier for conversion of charge into a voltage signal.

14. The image sensor of claim 13 , wherein the charge-carrying region comprises a tapered region having a width that decreases along at least a portion of its length.

15. The image sensor of claim 1 , further comprising a plurality of control gate electrodes extending across slanted regions of dark pixels of at least two sub-arrays.

16. The image sensor of claim 1 , wherein the HCCD comprises a plurality of shift registers having substantially equal dimensions in a direction of charge transfer within the HCCD.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 038620, FRAME 0087 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PATENT NUMBER 5859768 AND TO RECITE COLLATERAL AGENT ROLE OF RECEIVING PARTY IN THE SECURITY INTEREST PREVIOUSLY RECORDED ON REEL 038620 FRAME 0087. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Aug 25, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 039853/0001 →
SECURITY INTEREST Recorded Apr 15, 2016
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 038620/0087 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2014
From: TRUESENSE IMAGING, INC.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 033460/0457 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2013
From: WANG, SHEN
To: TRUESENSE IMAGING, INC.
Reel/Frame 031190/0549 →