Memory system having thermally stable perpendicular magneto tunnel junction (MTJ) and a method of manufacturing same
A spin-transfer torque magnetic random access memory (STTMRAM) element employed to store a state based on the magnetic orientation of a free layer, the STTMRAM element is made of a first perpendicular free layer (PFL) including a first perpendicular enhancement layer (PEL). The first PFL is formed on top of a seed layer. The STTMRAM element further includes a barrier layer formed on top of the first PFL and a second perpendicular reference layer (PRL) that has a second PEL. The second PRL is formed on top of the barrier layer. The STTMRAM element further includes a capping layer that is formed on top of the second PRL.
1. A spin-transfer torque magnetic random access memory (STTMRAM) element comprising:
a free layer including:
a first and a second free sub-layers having a variable magnetization direction substantially perpendicular to layer planes thereof; and
a first perpendicular enhancement layer (PEL) interposed between the first and second free sub-layers;
a barrier layer formed adjacent to the free layer; and
a reference layer formed adjacent to the barrier layer opposite the free layer, the reference layer including:
a first and a second reference sub-layers having a first invariable magnetization direction;
a second PEL interposed between the first and second reference sub-layers;
an antiferromagnetic coupling layer formed adjacent to the second reference sub-layer opposite the second PEL; and
a third reference sub-layer formed adjacent to the antiferromagnetic coupling layer opposite the second reference sub-layer and having a second invariable magnetization direction that is substantially perpendicular to a layer plane of the third reference sub-layer and opposite to the first invariable magnetization direction,
wherein the first reference sub-layer comprises cobalt, iron, and boron.
2. The STTMRAM element, as recited in claim 1 , wherein the free layer further includes a spin polarization enhanced layer (SPEL) in physical contact with the barrier layer and the first free sub-layer.
3. The STTMRAM element, as recited in claim 1 , wherein the reference layer further includes a spin polarization enhanced layer (SPEL) in physical contact with the barrier layer and the first reference sub-layer comprising cobalt, iron, and boron.
4. The STTMRAM element, as recited in claim 1 , wherein the first PEL is made of an elemental metal of molybdenum, tungsten, niobium, or yttrium.
5. The STTMRAM element, as recited in claim 1 , wherein the first and second reference sub-layers are in physical contact with the second PEL.
6. A spin-transfer torque magnetic random access memory (STTMRAM) element comprising:
a free layer including:
a first and a second free sub-layers having a variable magnetization direction substantially perpendicular to layer planes thereof; and
a first perpendicular enhancement layer (PEL) interposed between the first and second free sub-layers;
a barrier layer formed adjacent to the free layer; and
a reference layer formed adjacent to the barrier layer opposite the free layer, the reference layer including:
a first and a second reference sub-layers having a first invariable magnetization direction;
a second PEL interposed between the first and second reference sub-layers;
an antiferromagnetic coupling layer formed adjacent to the second reference sub-layer opposite the second PEL; and
a third reference sub-layer formed adjacent to the antiferromagnetic coupling layer opposite the second reference sub-layer and having a second invariable magnetization direction that is substantially perpendicular to a layer plane of the third reference sub-layer and opposite to the first invariable magnetization direction,
wherein the first reference sub-layer comprises cobalt, iron, and boron, and
wherein the first and second free sub-layers each comprise cobalt, iron, and boron.
7. A spin-transfer torque magnetic random access memory (STTMRAM) element comprising:
a free layer including:
a first and a second CoFeB free sub-layers having a variable magnetization direction substantially perpendicular to layer planes thereof; and
a first perpendicular enhancement layer (PEL) made of an elemental metal of molybdenum or tungsten interposed between the first and second CoFeB free sub-layers;
a barrier layer formed adjacent to the free layer; and
a reference layer formed adjacent to the barrier layer opposite the free layer, the reference layer including:
a first and a second reference sub-layers having a first invariable magnetization direction substantially perpendicular to layer planes thereof;
a second PEL interposed between the first and second reference sub-layers;
an antiferromagnetic coupling layer formed adjacent to the second reference sub-layer opposite the second PEL; and
a third reference sub-layer formed adjacent to the antiferromagnetic coupling layer opposite the second reference sub-layer and having a second invariable magnetization direction that is substantially perpendicular to a layer plane of the third reference sub-layer and opposite to the first invariable magnetization direction,
wherein the first reference sub-layer comprises cobalt, iron, and boron.
8. The STTMRAM element, as recited in claim 7 , wherein the reference layer further includes a spin polarization enhanced layer (SPEL) in physical contact with the barrier layer and the first reference sub-layer comprising cobalt, iron, and boron.
9. The STTMRAM element, as recited in claim 7 , wherein the free layer further includes a spin polarization enhanced layer (SPEL) in physical contact with the barrier layer and the first CoFeB free sub-layer.
10. The STTMRAM element, as recited in claim 7 , wherein the second PEL is made of an elemental metal selected from tantalum (Ta), titanium (Ti), hafnium (Hf), niobium (Nb), vanadium (V), yttrium (Y), tungsten (W), chromium (Cr), and molybdenum (Mo).
11. The STTMRAM element, as recited in claim 7 , wherein the first and second CoFeB free sub-layers are in physical contact with the first PEL.
12. The STTMRAM element, as recited in claim 7 , wherein the first and second reference sub-layers are in physical contact with the second PEL.
13. The STTMRAM element, as recited in claim 7 , wherein the second reference sub-layer comprises cobalt, iron, and boron.