Process of forming an electronic device including a vertical conductive structure
An electronic device can include a buried conductive region and a semiconductor layer over the buried conductive region. The electronic device can further include a horizontally-oriented doped region and a vertical conductive region, wherein the vertical conductive region is electrically connected to the horizontally-oriented doped region and the buried conductive region. The electronic device can still further include an insulating layer overlying the horizontally-oriented doped region, and a first conductive electrode overlying the insulating layer and the horizontally-oriented doped region, wherein a portion of the vertical conductive region does not underlie the first conductive electrode. The electronic device can include a Schottky contact that allows for a Schottky diode to be connected in parallel with a transistor. Processes of forming an electronic device allow a vertical conductive region to be formed after a conductive electrode, a gate electrode, a source region, or both.
1. A process of forming an electronic device comprising:
providing a workpiece including a buried conductive region and a semiconductor layer over the buried conductive region, wherein the semiconductor layer has a primary surface and an opposing surface, and wherein the buried conductive region is disposed closer to the opposing surface than to the primary surface;
forming a conductive electrode;
forming a source region of a transistor after forming the conductive electrode; and
forming a vertical conductive region adjacent to the primary surface and extending through the semiconductor layer toward the buried conductive region, wherein forming the vertical conductive region is performed after forming the conductive electrode,
wherein in a finished device, the conductive electrode and the source region are electrically connected to each other.
2. The process of claim 1 , wherein forming the conductive electrode comprises:
forming a conductive layer; and
patterning the conductive layer to define an opening above a region of the semiconductor layer in which the vertical conductive region is subsequently formed.
3. The process of claim 2 , wherein forming the source region is performed after patterning the conductive layer.
4. The process of claim 1 , wherein forming the vertical conductive region comprises:
etching the semiconductor layer to define a trench that extends toward the conductive buried region; and
forming a conductive material within the trench to at least partly fill the trench.
5. The process of claim 4 , wherein etching the semiconductor layer is performed such that the trench extends to the buried conductive region.
6. The process of claim 4 , further comprising removing a portion of the conductive material lying outside of the trench to form the vertical conductive region.
7. The process of claim 6 , wherein the vertical conductive region fills substantially all of the trench.
8. The process of claim 1 , further comprising forming a horizontally-oriented doped region within the semiconductor layer adjacent to the primary surface, wherein a drain region of the transistor includes the horizontally-oriented doped region.
9. The process of claim 1 , further comprising forming an electrical connection between the source region and the conductive electrode, wherein forming the electrical connection is performed after forming the conductive electrode.
10. A process of forming an electronic device comprising:
providing a workpiece including a buried conductive region and a semiconductor layer over the buried conductive region, wherein the semiconductor layer has a primary surface and an opposing surface, and wherein the buried conductive region is disposed closer to the opposing surface than to the primary surface;
forming a first conductive electrode;
forming a gate electrode after forming the first conductive electrode; and
forming a vertical conductive region adjacent to the primary surface and extending through the semiconductor layer toward the buried conductive region, wherein forming the vertical conductive region is performed after forming the gate electrode and forming the first conductive electrode,
wherein in a finished device, the first conductive electrode and the gate electrode are electrically isolated from each other.
11. The process of claim 10 , further comprising forming a horizontally-oriented doped region within the semiconductor layer adjacent to the primary surface, wherein forming the first conductive electrode is performed after forming the horizontally-oriented doped region.
12. The process of claim 11 , further comprising forming a first insulating layer over the horizontally-oriented doped region and before forming the first conductive electrode, wherein after forming the first conductive electrode, the first conductive electrode is disposed over the insulating layer and the horizontally-oriented doped region.
13. The process of claim 12 , further comprising:
forming a second insulating layer over the vertical conductive region, wherein the second insulating layer is thicker than the first insulating layer; and
forming a second conductive electrode overlying the vertical conductive region.
14. The process of claim 13 , further comprising forming a source region of the transistor, wherein in a finished device, the source region, the first conductive electrode, and the second conductive electrode are electrically connected to one another.
15. The process of claim 1 , wherein the conductive electrode is spaced apart from the source region of the transistor.
16. A process of forming an electronic device comprising:
providing a workpiece including a buried conductive region and a semiconductor layer over the buried conductive region, wherein the semiconductor layer has a primary surface and an opposing surface, and wherein the buried conductive region is disposed closer to the opposing surface than to the primary surface;
forming a conductive electrode by:
forming a conductive layer; and
patterning the conductive layer to define an opening above a region of the semiconductor layer in which the vertical conductive region is subsequently formed;
forming a source region of a transistor after patterning the conductive layer; and
forming a vertical conductive region adjacent to the primary surface and extending through the semiconductor layer toward the buried conductive region, wherein forming the vertical conductive region is performed after forming the conductive electrode,
wherein in a finished device, the conductive electrode and the source region are electrically connected to each other.
17. The process of claim 16 , further comprising forming a horizontally-oriented doped region within the semiconductor layer adjacent to the primary surface, wherein forming the first conductive electrode is performed after forming the horizontally-oriented doped region.
18. The process of claim 17 , further comprising forming a first insulating layer over the horizontally-oriented doped region and before forming the first conductive electrode, wherein after forming the first conductive electrode, the first conductive electrode is disposed over the insulating layer and the horizontally-oriented doped region.
19. The process of claim 18 , further comprising:
forming a second insulating layer over the vertical conductive region, wherein the second insulating layer is thicker than the first insulating layer; and
forming a second conductive electrode overlying the vertical conductive region.
20. The process of claim 16 , wherein the conductive electrode is spaced apart from the source region of the transistor.