IP Library Granted Patent US 8,986,050
Granted Patent B2
US 8,986,050 · App. 13/841,934 · Granted Mar 24, 2015

Connector of a universal serial bus device

Inventors: Anthony King (San Jose, CA); Robert C. Miller (San Jose, CA); Suresh Upadhyayula (San Jose, CA)
Assignee: Sandisk Technologies Inc.
G06K19/07743
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Quick Facts
Patent No.
US 8,986,050
App. No.
13/841,934
Granted
Mar 24, 2015
Kind
B2
Abstract

In a particular embodiment, a connector includes a connector module and a set of conductive connectors coupled to the connector module. The set of conductive connectors is configured to electrically couple to a set of contacts of a memory module. The connector also includes a ground contact coupled to the connector module. The ground contact is configured to be coupled to a ground of the memory module and to a conductive shroud.

Claims (27)

1. A connector comprising:

a connector module;

a set of conductive connectors coupled to the connector module, the set of conductive connectors configured to electrically couple to a set of contacts of a memory module; and

a ground contact coupled to the connector module, wherein the ground contact is configured to be coupled to a ground pad of the memory module via pressure applied by a conductive shroud.

2. The connector of claim 1 , wherein the memory module includes a flash memory.

3. The connector of claim 1 , wherein the ground contact is configured to be coupled to the ground pad of the memory module via a soldered connection.

4. The connector of claim 1 , wherein the conductive shroud is a metal shield.

5. The connector of claim 1 , wherein a configuration of the set of conductive connectors is compliant with a universal serial bus standard.

6. A connector comprising:

a connector module;

a carrier configured to receive a memory module, the carrier including a living hinge; and

a conductive connector coupled to the connector module, the conductive connector configured to provide a solderless connection to a contact of the memory module.

7. The connector of claim 6 , wherein the connector module and the carrier comprise a single piece of plastic.

8. The connector of claim 6 , wherein, after the carrier has received the memory module and has been inserted into a shroud, a clamping force applied by the shroud causes the conductive connector to be in contact with the contact of the memory module.

9. The connector of claim 6 , further comprising another conductive connector coupled to another contact of the memory module.

10. The connector of claim 6 , further comprising a ground contact coupled to the connector module, wherein the ground contact is configured to provide a conductive path between the memory module and a conductive shroud.

11. The connector of claim 6 , wherein the memory module includes a flash memory.

12. A connector comprising:

a connector module;

a carrier configured to receive a memory module; and

a conductive connector coupled to the connector module, the conductive connector configured to provide a solderless connection to a contact of the memory module wherein, when the carrier has received the memory module and is inserted into a conductive shroud, a clamping force applied by the conductive shroud causes the conductive connector to be in contact with the contact of the memory module.

13. The connector of claim 12 , wherein the carrier includes a hinge configured to enable reception of the memory module.

14. The connector of claim 13 , wherein the hinge is a living hinge.

15. The connector of claim 12 , wherein the connector module and the carrier comprise a single piece of plastic.

16. The connector of claim 12 , further comprising another conductive connector coupled to another contact of the memory module.

17. The connector of claim 12 , further comprising a ground contact coupled to the connector module, wherein the ground contact is configured to provide a conductive path between the memory module and a conductive shroud.

18. The connector of claim 12 , wherein the memory module includes a flash memory.

Assignments (5)
SECURITY AGREEMENT Recorded Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
PARTIAL RELEASE OF SECURITY INTERESTS Recorded Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
CHANGE OF NAME Recorded May 25, 2016
From: SANDISK TECHNOLOGIES INC
To: SANDISK TECHNOLOGIES LLC
Reel/Frame 038807/0898 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 26, 2013
From: KING, ANTHONY; MILLER, ROBERT C.; UPADHYAYULA, SURESH
To: SANDISK TECHNOLOGIES INC.
Reel/Frame 030084/0559 →
Continuity (2)
Provisional Application 61780596 · Mar 13, 2013
Related Publication 20140273558A1 · Sep 18, 2014