IP Library Granted Patent US 9,435,952
Granted Patent B2
US 9,435,952 · App. 13/914,089 · Granted Sep 6, 2016

Integration of a MEMS beam with optical waveguide and deflection in two dimensions

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Quick Facts
Patent No.
US 9,435,952
App. No.
13/914,089
Granted
Sep 6, 2016
Kind
B2
Abstract

A high density, low power, high performance information system, method and apparatus are described in which an integrated circuit apparatus includes a plurality of deflectable MEMS optical beam waveguides (e.g., 190 ) at each die edge which are each formed with an optical beam structure ( 193 ) which is encapsulated by a waveguide beam structure ( 194 ) to extend into a deflection cavity ( 198 ) and which is surrounded by a plurality of deflection electrodes ( 195 - 197 ) that are positioned on walls of the deflection cavity ( 198 ) to provide two-dimensional deflection control of each deflectable MEMS optical beam waveguide in response to application of one or more deflection voltages to provide optical communications (e.g., 184 ) between different die.

Claims (30)

1. An apparatus comprising:

a deflectable MEMS optical beam waveguide which is formed in an integrated circuit; and

a plurality of deflection electrodes positioned around the deflectable MEMS optical beam waveguide to provide two-dimensional deflection control for the deflectable MEMS optical beam waveguide in response to application of one or more deflection voltages.

2. The apparatus of claim 1 , where the plurality of deflection electrodes comprises a at least two lateral deflection electrodes positioned laterally to one side of the deflectable MEMS optical beam waveguide, where each of the at least two lateral deflection electrodes may be connected to a separate deflection voltage to provide a separate lateral deflection force.

3. The apparatus of claim 1 , where the plurality of deflection electrodes comprises first and second vertical deflection electrodes positioned above the deflectable MEMS optical beam waveguide, where each of the first and second vertical deflection electrodes may be connected to a separate deflection voltage to provide a separate vertical deflection force.

4. The apparatus of claim 1 , where the plurality of deflection electrodes comprises:

a first lateral deflection electrode positioned laterally to one side of the deflectable MEMS optical beam waveguide, where the first lateral deflection electrode may be connected to a first deflection voltage to provide a lateral deflection force; and

a first vertical deflection electrode positioned above the deflectable MEMS optical beam waveguide, where the first vertical deflection electrode may be connected to a second deflection voltage to provide a vertical deflection force.

5. The apparatus of claim 1 , where the plurality of deflection electrodes comprises:

a first lateral deflection electrode positioned laterally to a first side of the deflectable MEMS optical beam waveguide;

a second lateral deflection electrode positioned laterally to second, opposite side of the deflectable MEMS optical beam waveguide;

a first vertical deflection electrode positioned above the deflectable MEMS optical beam waveguide; and

a second vertical deflection electrode positioned below the deflectable MEMS optical beam waveguide,

where each of the first lateral deflection electrode, second lateral deflection electrode, first vertical deflection electrode, second vertical deflection electrode may be connected to a separate deflection voltage to provide a separate deflection force on the deflectable MEMS optical beam waveguide.

6. The apparatus of claim 1 , where the deflectable MEMS optical beam waveguide comprises a cantilevered optical beam structure comprising silicon which is encapsulated by a waveguide beam structure comprising oxide to limit dispersion of light from the cantilevered optical beam structure.

7. The apparatus of claim 1 , where the plurality of deflection electrodes comprises a plurality of deflection electrodes, each comprising a silicide layer.

8. The apparatus of claim 1 , further comprising a plurality of top and side electrodes formed on the deflectable MEMS optical beam waveguide with a plurality of conductive layers formed in the deflectable MEMS optical beam waveguide to provide two-dimensional deflection control of the deflectable MEMS optical beam waveguide.

9. The apparatus of claim 1 , where each deflectable MEMS optical beam waveguide comprises a cantilevered optical beam structure comprising silicon oxide which is encapsulated by a waveguide beam structure comprising silicon to limit dispersion of light from the cantilevered optical beam structure.

10. The apparatus of claim 1 , further comprising optical circuitry in which a laser transmitter generates a laser beam which is modulated with signal information to generate optical signal information which transmitted on an optical beam waveguide to the deflectable MEMS optical beam waveguide at a die edge.

11. The apparatus of claim 1 , where the deflectable MEMS optical beam waveguide is formed with a cantilevered optical beam structure which is encapsulated by a waveguide beam structure to extend into a deflection cavity formed in the integrated circuit, where the plurality of deflection electrodes are positioned on walls of the deflection cavity.

12. The apparatus of claim 1 , where the deflectable MEMS optical beam waveguide extends to a die edge side surface of the integrated circuit.

13. A method comprising:

providing a plurality of deflection voltages to a corresponding plurality of deflection electrodes positioned around a deflectable integrated circuit MEMS optical beam waveguide to provide two-dimensional deflection control of the deflectable integrated circuit MEMS optical beam waveguide in response to application of the plurality of deflection voltages.

14. The method of claim 13 , where providing the plurality of deflection voltages comprises:

providing a first plurality of deflection voltages to a corresponding first plurality of deflection electrodes positioned on a wall of the deflection cavity on a first side of the deflectable integrated circuit MEMS optical beam waveguide;

providing a second plurality of deflection voltages to a corresponding second plurality of deflection electrodes positioned on a wall of the deflection cavity on a second, opposite side of the deflectable integrated circuit MEMS optical beam waveguide;

providing a third plurality of deflection voltages to a corresponding third plurality of deflection electrodes positioned on a wall of the deflection cavity above the deflectable integrated circuit MEMS optical beam waveguide, thereby providing two-dimensional deflection control of the deflectable integrated circuit MEMS optical beam waveguide in response to application of the plurality of deflection voltages.

15. The method of claim 13 , where providing the plurality of deflection voltages comprises:

providing a first deflection voltage to a first deflection electrode positioned on a wall of the deflection cavity on a first side of the deflectable integrated circuit MEMS optical beam waveguide; and

providing a second deflection voltage to a second deflection electrode positioned on a wall of the deflection cavity above the deflectable integrated circuit MEMS optical beam waveguide, thereby providing two-dimensional deflection control of the deflectable integrated circuit MEMS optical beam waveguide in response to application of the first and second deflection voltages.

Assignments (30)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2025
From: NXP USA, INC.
To: ASCALE TECHNOLOGIES LLC
Reel/Frame 070026/0838 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
MERGER Recorded Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 6, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037445/0592 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0844 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0819 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0804 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031248/0698 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 031248/0750 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031248/0627 →
SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031248/0510 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2013
From: STEPHENS, TAB A.; PELLEY, PERRY H.; MCSHANE, MICHAEL B.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 030580/0161 →