IP Library Assignment 037445/0592
Patent Assignment
Reel/Frame 037445/0592

Assignment and Assumption of Security Interest in Patents

Recorded: 2016-01-06 Pages: 11
Assignor
CITIBANK, N.A.
Executed: 2015-12-07
Assignee
MORGAN STANLEY SENIOR FUNDING, INC.
1300 THAMES STREET, 4TH FLOOR, BALTIMORE, MARYLAND, 21231
Covered Properties (48)
Probe Out-of-Position Sensing for Automated Test Equipment
Patent: 8,901,947 →
Application: 13/629,924 →
Publication: US 2014/0091820
Clock Multiplexer
Patent: 8,860,468 →
Application: 13/912,170 →
Optical Wafer and Die Probe Testing
Patent: 9,261,556 →
Application: 13/913,993 →
Publication: US 2014/0363905
Die Stack with Optical Tsvs
Patent: 9,094,135 →
Application: 13/914,021 →
Publication: US 2014/0363172
Communication System Die Stack
Patent: 9,091,820 →
Application: 13/914,049 →
Publication: US 2014/0362425
Integration of a Mems Beam with Optical Waveguide and Deflection in Two Dimensions
Patent: 9,435,952 →
Application: 13/914,089 →
Publication: US 2014/0363119
Method and Apparatus for Beam Control with Optical Mems Beam Waveguide
Patent: 9,442,254 →
Application: 13/914,123 →
Publication: US 2015/0253511
Optical Redundancy
Patent: 9,766,409 →
Application: 13/914,149 →
Publication: US 2014/0363124
Optical Backplane Mirror
Patent: 9,810,843 →
Application: 13/914,178 →
Publication: US 2014/0363120
Optical Die Test Interface
Application: 13/914,199 →
Publication: US 2014/0363153
System and Method for Demodulating an Incoming Signal
Patent: 9,143,190 →
Application: 13/916,146 →
Publication: US 2014/0254636
Esd Protection Device
Patent: 9,659,922 →
Application: 13/917,580 →
Publication: US 2014/0367830
Semiconductor Device with Redistributed Contacts
Patent: 8,765,527 →
Application: 13/917,639 →
Mold Cap for Semiconductor Device
Patent: 9,030,000 →
Application: 13/917,641 →
Publication: US 2014/0367840
Inertial Sensor with Trim Capacitance and Method of Trimming Offset
Application: 13/919,638 →
Publication: US 2015/0268268
Scaled Sigma Sampling
Patent: 8,806,418 →
Application: 13/921,897 →
Die Fracture Detection and Humidity Protection with Double Guard Ring Arrangement
Patent: 9,070,683 →
Application: 13/922,759 →
Publication: US 2014/0375341
Lead Frame and Semiconductor Device Using Same
Application: 13/924,623 →
Publication: US 2014/0374892
Capillary Bonding Tool and Method of Forming Wire Bonds
Application: 13/924,625 →
Publication: US 2014/0374467
Wire Bonding Method for Flexible Substrates
Application: 13/924,626 →
Publication: US 2014/0374151
Semiconductor Device with Heat Spreader and Thermal Sheet
Application: 13/924,627 →
Publication: US 2014/0374891
Semiconductor Sensor Device with Metal Lid
Application: 13/924,628 →
Publication: US 2014/0374848
Pressure Sensor and Method of Packaging Same
Application: 13/924,633 →
Publication: US 2014/0374855
Frequency-Domain Amplitude Normalization For Symbol Correlation In Multi-Carrier Systems
Patent: 9,100,261 →
Application: 13/924,792 →
Publication: US 2014/0376648
Angular Rate Sensor with Quadrature Error Compensation
Patent: 9,476,711 →
Application: 13/924,880 →
Publication: US 2014/0374849
Frequency-Domain Carrier Blanking For Multi-Carrier Systems
Application: 13/924,940 →
Publication: US 2014/0376667
Frequency-Domain Frame Synchronization In Multi-Carrier Systems
Patent: 9,106,499 →
Application: 13/924,996 →
Publication: US 2014/0376674
Frequency-Domain Symbol And Frame Synchronization In Multi-Carrier Systems
Patent: 9,282,525 →
Application: 13/925,023 →
Publication: US 2014/0376540
System and Method for Low-Latency Addressing in Flash Memory
Patent: 8,886,874 →
Application: 13/925,807 →
Wireless Communication Apparatus and Method
Patent: 9,220,042 →
Application: 13/925,831 →
Publication: US 2014/0376510
Method for Fabricating Multiple Types of Mems Devices
Patent: 9,034,679 →
Application: 13/926,652 →
Publication: US 2014/0374851
Reconfigurable Flip-Flop
Patent: 9,124,262 →
Application: 13/927,936 →
Publication: US 2014/0062560
Non-Volatile Memory (Nvm) and High Voltage Transistor Integration
Patent: 9,006,093 →
Application: 13/928,666 →
Publication: US 2015/0001612
System with Feature of Saving Dynamic Power of Flip-Flop Banks
Patent: 9,310,829 →
Application: 13/928,671 →
Publication: US 2015/0006944
Packaged Semiconductor Device
Patent: 9,287,200 →
Application: 13/928,876 →
Publication: US 2015/0001691
Optimizing Error Parsing in an Integrated Development Environment
Patent: 9,710,360 →
Application: 13/929,002 →
Publication: US 2015/0007139
Method and System for Recovering from Transistor Aging Using Heating
Patent: 9,000,507 →
Application: 13/929,013 →
Publication: US 2015/0002211
Multi-Layer Process-Induced Damage Tracking and Remediation
Patent: 8,832,624 →
Application: 13/929,114 →
Semiconductor Package Having Wire Bond Wall to Reduce Coupling
Patent: 9,401,342 →
Application: 13/929,688 →
Publication: US 2015/0002226
Die-To-Die Inductive Communication Devices and Methods
Patent: 9,466,413 →
Application: 13/930,236 →
Publication: US 2015/0001948
Die-To-Die Inductive Communication Devices and Methods
Application: 13/930,250 →
Publication: US 2015/0004902
Integrated Circuits and Methods for Monitoring Forward and Reverse Back Biasing
Patent: 8,994,446 →
Application: 13/930,657 →
Publication: US 2015/0002215
Method for Detecting Bank Collision at a Memory and Device Therefor
Patent: 9,116,799 →
Application: 13/931,945 →
Publication: US 2015/0006827
Method, System, and Computer Program Product
Patent: 9,348,723 →
Application: 13/977,076 →
Publication: US 2013/0305099
Integrated Circuit Device and Method for Calculating a Predicate Value
Application: 13/977,082 →
Publication: US 2013/0290686
Phased-Array Receiver, Radar System and Vehicle
Patent: 9,411,039 →
Application: 13/977,087 →
Publication: US 2013/0293411
Integrated Circuit Device and Method for Performing Conditional Negation of Data
Application: 13/995,190 →
Publication: US 2013/0275725
Tin-Based Wirebond Structures
Application: 61/835,718 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 17, 2013
From: ZHAN, ROUYING; GILL, CHAI EAN
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 030819/0765 →
Supplement to Ip Security Agreement Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 031248/0750 →
Supplement to Ip Security Agreement Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031248/0698 →
Supplement to Ip Security Agreement Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031248/0627 →
Supplement to Ip Security Agreement Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031248/0510 →
Assignment of Assignor's Interest Feb 18, 2015
From: STEPHENS, JAMES A.; DELBECQ, DOMINIQUE; PERRINE, DANIEL M.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 035034/0272 →
Patent Release Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0819 →
Patent Release Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0844 →
Patent Release Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0804 →
Assignment and Assumption of Security Interest in Patents Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
Security Agreement Supplement Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Supplement to the Security Agreement Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Release of Security Interest Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
Release of Security Interest Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
Change of Name Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040632/0001 →
Merger Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
Change of Name Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
Merger Jan 3, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041144/0363 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040652 Frame: 0241. Assignor(S) Hereby Confirms the Merger and Change of Name. Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040626 Frame: 0683. Assignor(S) Hereby Confirms the Merger and Change of Name Effective November 7, 2016. Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
Corrective Assignment to Correct the Remove Patents 8108266 and 8062324 and Replace Them with 6108266 and 8060324 Previously Recorded on Reel 037518 Frame 0292. Assignor(S) Hereby Confirms the Assignment and Assumption of Security Interest in Patents. Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded at Reel: 040632 Frame: 0001. Assignor(S) Hereby Confirms the Merger and Change of Name. Sep 21, 2017
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 044209/0047 →