IP Library Granted Patent US 9,766,409
Granted Patent B2
US 9,766,409 · App. 13/914,149 · Granted Sep 19, 2017

Optical redundancy

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Quick Facts
Patent No.
US 9,766,409
App. No.
13/914,149
Granted
Sep 19, 2017
Kind
B2
Abstract

A high density, low power, high performance information system, method and apparatus are described in which an integrated circuit apparatus includes a first integrated circuit link element ( 657 ) and a redundant integrated circuit link element ( 660 ) connected in parallel between first and second deflectable MEMS switches ( 652 - 655, 662 - 665 ) which are connected in a signal path and controlled to deselect the first integrated circuit link element ( 657 ) and connect the redundant integrated circuit link element ( 660 ) in the signal path in response to a two-state control signal provided to the first and second deflectable MEMs switches which identifies the first integrated circuit link element as being defective.

Claims (25)

1. An apparatus comprising:

a first deflectable MEMS switch comprising a first deflectable optical beam waveguide that is deflectable under a first electric field influence;

a second deflectable MEMS switch comprising a second deflectable optical beam waveguide that is deflectable under a second electric field influence; and

a first optical link element and a redundant optical link element located in parallel between the first and second deflectable MEMS switches which are controlled to deselect the first optical link element and connect the redundant optical link element in an optical signal path in response to an indication that the first optical link element is defective.

2. The apparatus of claim 1 , where the first optical link element and redundant optical link element comprise, respectively, a first optical circuit and a redundant optical circuit formed in a single integrated circuit.

3. The apparatus of claim 1 , where the first optical link element comprises a first die edge MEMS I/O beam deflector formed on a first die and a second die edge MEMS I/O beam deflector formed on a second die that is separate from the first die edge by an open air gap, where the first and second die edge MEMS I/O beam deflectors are coupled in the signal path during a normal mode.

4. The apparatus of claim 3 , where the redundant optical link element comprises a first redundant die edge MEMS I/O beam deflector formed on the first die and a second redundant die edge MEMS I/O beam deflector formed on the second die, where the first and second redundant die edge MEMS I/O beam deflectors are coupled in the signal path during a replacement mode.

5. The apparatus of claim 1 , further comprising one or more electrical fuse circuits which may be programmed to provide the indication.

6. The apparatus of claim 1 , where each of the first and second deflectable MEMS optical beam waveguides are each formed with an optical beam structure which is encapsulated by a waveguide beam structure to extend into a deflection cavity and which is surrounded by a plurality of deflection electrodes that are positioned to provide two-dimensional deflection control of each deflectable MEMS optical beam waveguide in response to application of one or more deflection voltages.

7. The apparatus of claim 1 , where each of the first and second deflectable MEMS switches comprises an optical beam structure which is encapsulated by a waveguide beam structure and a plurality of deflection electrodes positioned to provide two-dimensional deflection control of each deflectable MEMS switch in response to application of one or more deflection voltages in response to the indication.

8. The apparatus of claim 1 , where the first optical link element comprises a first die edge MEMS I/O beam deflector formed on a first die and a second die edge MEMS I/O beam deflector formed on a second die that is separate from the first die edge by an open air gap, where the first and second die edge MEMS I/O beam deflectors are coupled in the signal path during a normal mode.

9. A method comprising:

providing a first optical link element and a redundant optical link element located in parallel between first and second deflectable MEMS switches which are coupled in an optical signal path in response to one or more control signals, where the first and second deflectable MEMS switches comprise, respectively, first and second deflectable MEMS optical beam waveguides, each of which are deflectable under a separate electric field influence; and

applying one or more first control signals to the first and second deflectable MEMS switches to disconnect the first optical link element and to connect the redundant optical link element in the optical signal path in response to an indication that the first optical link element is defective.

10. The method of claim 9 , where the first optical link element and redundant optical link element comprise, respectively, a first optical circuit and a redundant optical circuit formed in a single integrated circuit.

11. The method of claim 9 , where providing the first optical link element comprises providing a first die edge MEMS I/O beam deflector formed on a first die and a second die edge MEMS I/O beam deflector formed on a second die that is separate from the first die edge by an open air gap, where the first and second die edge MEMS I/O beam deflectors are coupled in the optical signal path during a normal mode.

12. The method of claim 11 , where providing the redundant optical link element comprises providing a first redundant die edge MEMS I/O beam deflector formed on the first die and a second redundant die edge MEMS I/O beam deflector formed on the second die that is separate from the first die edge by an open air gap, where the first and second redundant die edge MEMS I/O beam deflectors are coupled in the optical signal path during a replacement mode in response to application of the one or more first control signals.

13. The method of claim 9 , where the first optical link element is determined to be defective by applying predefined functionality criteria to assess a functionality measure of the first optical link element.

14. The method of claim 9 , where the first optical link element is determined to be defective by generating the one or more first control signals from one or more data values stored in a non-volatile storage circuit.

15. The method of claim 9 , where applying one or more first control signals to the first and second deflectable MEMS switches comprises applying a plurality of deflection voltages to a first plurality of deflection electrodes positioned around a first deflectable MEMS optical beam waveguide and to a second plurality of deflection electrodes positioned around second deflectable MEMS optical beam waveguide to provide two-dimensional deflection control of each deflectable MEMS optical beam waveguide, thereby disconnecting the first optical link element and connecting the redundant optical link element in the optical signal path.

16. An apparatus comprising:

a first deflectable MEMS optical beam waveguide formed in an optical beam plane to extend into a deflection cavity with a first plurality of deflection electrodes positioned to provide two-dimensional deflection control of the first deflectable MEMS optical beam waveguide in response to application of one or more deflection voltages to the first plurality of deflection electrodes;

a second deflectable MEMS optical beam waveguide formed in the optical beam plane for optical communication alignment with the first deflectable MEMS optical beam waveguide with a second plurality of deflection electrodes positioned to provide two-dimensional deflection control of the second deflectable MEMS optical beam waveguide in response to application of one or more deflection voltages to the second plurality of deflection electrodes;

an optical link element formed in the optical beam plane to block optical communication between the first and second deflectable MEMS optical beam waveguides when positioned in a first deflection position; and

an optical reflection layer formed outside of the optical beam plane to provide a reflection surface in the deflection cavity for reflecting optical communications between the first and second deflectable MEMS optical beam waveguides when positioned in a second deflection position for reflecting optical communication off the optical reflection layer to cross over the optical link element by applying the one or more deflection voltages to the first and second plurality of deflection electrodes.

Assignments (30)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 6, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0819 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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SUPPLEMENT TO IP SECURITY AGREEMENT Recorded Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 10, 2013
From: PELLEY, PERRY H.; STEPHENS, TAB A.; MCSHANE, MICHAEL B.
To: FREESCALE SEMICONDUCTOR, INC.
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