Integrated circuit packaging system with trenched leadframe and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a leadframe having a trench; mounting an integrated circuit device on the leadframe; forming a top encapsulation on the leadframe and the trench; forming a lead having a lead protrusion and a peripheral groove, the lead protrusion and the peripheral groove formed from etching the trench at a leadframe bottom side; and forming a bottom encapsulation surrounding a lead bottom side of the lead.
1. An integrated circuit packaging system comprising:
a die paddle;
a lead adjacent to the die paddle, the lead having a peripheral groove and a lead protrusion;
an integrated circuit device on the die paddle;
a top encapsulation covering the integrated circuit device, a lead top side of the lead, the peripheral groove, and the lead protrusion; and
a bottom encapsulation surrounding a lead bottom side of the lead, the lead protrusion over the bottom encapsulation for anchoring the lead to the bottom encapsulation, and wherein the bottom encapsulation includes a system recess.
2. The system as claimed in claim 1 wherein the lead includes a top ring.
3. The system as claimed in claim 1 wherein the lead includes a top ball pad on a lead top side of the lead.
4. The system as claimed in claim 1 further comprising a system interconnect on the lead bottom side of the lead.
5. The system as claimed in claim 1 wherein the lead includes a top ring at the lead top side of the lead.
6. The system as claimed in claim 5 further comprising a support pad between the die paddle and the lead.
7. The system as claimed in claim 5 wherein the bottom encapsulation includes a paddle recess for exposing the die paddle from the bottom encapsulation.
8. The system as claimed in claim 5 further comprising a chip interconnect attached between the integrated circuit device and the lead.
9. The system as claimed in claim 5 further comprising an attach layer between the integrated circuit device and the die paddle.