Formation of large scale single crystalline graphene
A method for transfer of a two-dimensional material includes forming a spreading layer of a two-dimensional material on a first substrate. The spreading layer has at least one monolayer. A stressor layer is formed on the spreading layer. The stressor layer is configured to apply stress to a closest monolayer of the spreading layer. The closest monolayer is exfoliated by mechanically splitting the spreading layer wherein at least the closest monolayer remains on the stressor layer. The at least one monolayer is stamped against a second substrate to adhere remnants of the two-dimensional material on the at least one monolayer to the second substrate to provide a single monolayer on the stressor layer. The single monolayer is transferred to a third substrate.
1. A solid-state device structure, comprising:
a semiconductor substrate; and
a single crystalline monolayer of graphene disposed directly on a surface of the semiconductor substrate by a single transfer process and having a surface area of greater than 15 square inches.
2. The structure as recited in claim 1 , wherein the monolayer of graphene is patterned to form a conductive channel for electronic devices.
3. The solid-state device of claim 1 , wherein the single crystalline monolayer of graphene is present directly on an entirety of an upper surface of the semiconductor substrate.
4. The solid-state device of claim 1 , wherein the semiconductor substrate comprises Si, GaAs, SiG, GaN, InP or combination thereof.
5. The solid-state device of claim 1 , wherein the solid-state device comprises transistors, capacitors, electric wires, photosensitive devices, biosensors, wrap-around multi-channel transistors and combinations thereof.
6. The solid-state device of claim 1 , wherein the single crystalline monolayer of graphene is substantially free of defects.