IP Library Granted Patent US 9,552,279
Granted Patent B2
US 9,552,279 · App. 13/968,591 · Granted Jan 24, 2017

Data bus network interface module and method therefor

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Quick Facts
Patent No.
US 9,552,279
App. No.
13/968,591
Granted
Jan 24, 2017
Kind
B2
Abstract

A data bus network interface module for enabling reception and transmission of application messages to/from at least one host processing module of an integrated digital signal processing device via a data bus network is described. The data bus network interface module being arranged to receive at least one data bus message from at least one remote network node via the data bus network, read an identifier field of the received at least one data bus message, and make data content of the received at least one data bus message available to at least one debug module if the identifier field comprises an identifier value defined for debug use.

Claims (26)

1. A microcontroller device comprising:

a host processing module;

a debug module; and

a data bus network interface module for enabling reception and transmission of application messages to/from a remote network node via a data bus network, the data bus network interface module being arranged to:

receive a data bus message from the remote network node via the data bus network, read a non-data field of the data bus message, and make data content of the data bus message available to the debug module if the non-data field comprises a value defined for debug use; and

receive data from the debug module for transmission over the data bus network and, upon receipt of said data from the debug module, to generate a second data bus message containing the received data and comprising a second non-data field value defined for debug use.

2. The microcontroller device of claim 1 , wherein the data bus network interface module is further arranged to read an identifier field of the data bus message, and to make data content of the data bus message available to the debug module if the identifier field comprises an identifier value defined for debug use.

3. The microcontroller device of claim 1 , wherein the data bus network interface module is further arranged to make the data content of the data bus message available to the host processing module only if the non-data field comprises a value not defined for debug use.

4. The microcontroller device of claim 1 , wherein the data bus network interface module is further arranged to make the data content of the received data bus messages available to the debug module by loading said received data content into at least one memory element accessible by the data bus network interface module, and sending a request to a direct memory access module for said data content to be written from the at least one memory element accessible by the data bus network interface module to at least one memory element accessible by the debug module.

5. The microcontroller device of claim 1 , wherein the data bus network interface module comprises a vehicle bus interface module.

6. The microcontroller device of claim 1 , wherein the data bus network interface module comprises a controller area network interface module.

7. The microcontroller device of claim 1 , wherein said microcontroller device is included at a die within a single integrated circuit package.

8. The device of claim 1 , wherein the data received from the debug module for transmission over the data bus network is provided to a debug tool coupled to the data bus network.

9. A method comprising:

receiving, at a data bus network interface module included at a microcontroller device, a data bus message from a remote network node via a data bus network;

reading a non-data field of the received data bus message;

making data content of the received data bus message available to a debug module included at the microcontroller device if the non-data field comprises a value defined for debug use; and

receiving data from the debug module for transmission over the data bus network and, upon receipt of said data from the debug module, generating a second data bus message containing the received data and comprising a second non-data field value defined for debug use.

10. The method of claim 9 , further comprising:

reading an identifier field of the received data bus message, and making data content of the received data bus message available to the debug module if the identifier field comprises an identifier value defined for debug use.

11. The method of claim 9 , further comprising:

making data content of the received data bus message available to a host processing module included at a microcontroller device only if the non-data field comprises a value not defined for debug use.

12. The method of claim 9 , further comprising:

making data content of received data bus messages available to the debug module by loading said received data content into at least one memory element accessible by the data bus network interface module, and sending a request to a direct memory access module for said data content to be written from the at least one memory element accessible by the data bus network interface module to at least one memory element accessible by the debug module.

13. The method of claim 9 , wherein the data bus network interface module comprises a vehicle bus interface module.

14. The method of claim 9 , wherein the data received from the debug module for transmission over the data bus network is provided to a debug tool coupled to the data bus network.

Assignments (20)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNMENT DOCUMENTATION - INITIAL CONVENYANCE LISTED CHANGE OF NAME. PREVIOUSLY RECORDED ON REEL 040579 FRAME 0827. ASSIGNOR(S) HEREBY CONFIRMS THE UPDATE CONVEYANCE TO MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Dec 15, 2016
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 040945/0252 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
CHANGE OF NAME Recorded Nov 9, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040579/0827 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT PCT NUMBERS IB2013000664, US2013051970, US201305935 PREVIOUSLY RECORDED AT REEL: 037444 FRAME: 0787. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Oct 17, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 040450/0715 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 5, 2016
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PATENT RELEASE Recorded Dec 21, 2015
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From: MAIOLANI, MARK; MARSHALL, RAY C.; MILLER, GARY L.
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