Integrated circuit packaging system with side solderable leads and method of manufacture thereof
View Patent ↗A system and method of manufacture of an integrated circuit packaging system includes: a leadframe having a side solderable lead with a half-etched lead portion and a lead top side; a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body; a mold groove in the mold body and in a portion of the side solderable lead for exposing a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and the half-etched lead portion exposed from a lower perimeter side of the mold body.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a leadframe having a side solderable lead with a half-etched lead portion and a lead top side;
forming a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body;
removing a portion of the mold body and a portion of the side solderable lead for forming a mold groove in the mold body to expose a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and
singulating the mold body and the leadframe for exposing the half-etched lead portion from a lower perimeter side of the mold body.
2. The method as claimed in claim 1 wherein removing a portion of the mold body includes forming the lead protrusion extending over the mold groove.
3. The method as claimed in claim 1 wherein removing a portion of the side solderable lead includes forming a lead step in the lead protrusion.
4. The method as claimed in claim 1 wherein removing a portion of the mold body includes exposing the side solderable lead and the half-etched lead portion at the mold step.
5. The method as claimed in claim 1 wherein removing a portion of the mold groove includes chemically deflashing the mold groove for removing residue.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a leadframe having a die paddle and a side solderable lead with a half-etched lead portion and a lead top side;
forming a mold body directly on the leadframe, the die paddle, and the side solderable lead with the lead top side of the side solderable lead exposed from the mold body;
removing a portion of the mold body and a portion of the side solderable lead using laser ablation for forming a mold groove in the mold body to expose a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and
singulating the mold body and the leadframe for exposing the half-etched lead portion from a lower perimeter side of the mold body.
7. The method as claimed in claim 6 wherein removing a portion of the mold body includes forming the lead protrusion extending over the mold groove.
8. The method as claimed in claim 6 wherein removing a portion of the side solderable lead includes forming a lead step in the lead protrusion.
9. The method as claimed in claim 6 wherein removing a portion of the mold body includes exposing the side solderable lead and the half-etched lead portion at the mold step and on the upper perimeter side of the mold body using a green (532 nm) laser.
10. The method as claimed in claim 6 wherein removing a portion of the mold groove includes chemically deflashing the mold groove for removing residue.
11. An integrated circuit packaging system comprising:
a leadframe having a side solderable lead with a half-etched lead portion and a lead top side;
a mold body directly on the leadframe and the side solderable lead, the lead top side of the side solderable lead exposed from the mold body;
a mold groove in the mold body and in a portion of the side solderable lead for exposing a lead protrusion of the side solderable lead on an upper perimeter side of the mold body; and
the half-etched lead portion exposed from a lower perimeter side of the mold body.
12. The system as claimed in claim 11 wherein the lead protrusion extends over the mold groove.
13. The system as claimed in claim 11 wherein the lead protrusion includes a lead step formed at the top of the lead protrusion.
14. The system as claimed in claim 11 wherein the side solderable lead and the half-etched lead portion are exposed at the mold step.
15. The system as claimed in claim 11 wherein the mold groove is substantially free of residue.
16. The system as claimed in claim 11 wherein:
the leadframe includes a die paddle;
the mold body directly on the die paddle; and
the mold groove and the side solderable lead have the physical characteristics of laser ablation.
17. The system as claimed in claim 16 wherein the lead protrusion extends over the mold groove.
18. The system as claimed in claim 16 wherein the side solderable lead includes a lead step in the lead protrusion.
19. The system as claimed in claim 16 wherein the side solderable lead and the half-etched lead portion are exposed at the mold step and on the upper perimeter side of the mold body and have the physical characteristics of laser ablation using a green (532 nm) laser.
20. The system as claimed in claim 16 wherein the mold groove is substantially free of residue.