IP Library Granted Patent US 9,304,557
Granted Patent B2
US 9,304,557 · App. 14/086,032 · Granted Apr 5, 2016

Systems and methods for packaging high density SSDS

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,304,557
App. No.
14/086,032
Granted
Apr 5, 2016
Kind
B2
Abstract

In various embodiments, a high-density solid-state storage unit includes a base section and a cassette section having plurality of flash cards. The cassette section can be removably attached to the base section to provide security of data stored on the plurality of flash cards. The cassette section provides for physical security of the flash cards in part through packaging of the enclosure and energy transfer to the base station. The cassette section further provides for security of the data stored on the flash cards in part through a trusted platform module (TPM) embodied as a removable module connected to a universal serial bus (USB) style connector.

Claims (27)

1. A data storage unit comprising:

a base section;

a cassette section configured to be removably attached to the base section and having an interface through which solid-state storage modules located within the cassette section are accessible to the base section; and

a removable trusted platform module configured to provide security to the solid-state storage modules by authorizing operation of the cassette section and the base section when the cassette section is connected to the base section;

wherein a plurality of solid-state storage modules are arranged in a vertical fashion from the front of the cassette section to the back of the cassette section together with a bridge board that electronically connects the interface at the back of the cassette section to one or more components at the front of the cassette section;

wherein the cassette section further includes a gap filling material positioned between one or more internal components of the cassette section and an enclosing plate of the cassette section; and

wherein the gap filling material is futher configured to reduce vibration within the cassette section.

2. The data storage unit of claim 1 wherein the interface is configured to provide both an electrical connection between the cassette section and the base section as well as a mechanical connection between the cassette section and the base section.

3. The data storage unit of claim 1 wherein the cassette section further includes one or more guides placed on each of one or more surfaces, each guide having a taper from one end of the cassette section toward another end of the cassette section.

4. The data storage unit of claim 3 wherein the one or more guides are configured with a plurality of rounded channels diametrically opposed.

5. The data storage unit of claim 3 wherein the one or more guides include a first wedge receptor opposite a second wedge receptor.

6. The data storage unit of claim 1 wherein the base section includes one or more structures forming a plurality of environmental zones configured to separate airflow exiting the cassette section and airflow exiting the base section, at least one of the plurality of environmental zones designated for the cassette section.

7. The data storage unit of claim 1 wherein the trusted platform module is a chip included in a universal serial bus (USB) style connector.

8. The data storage unit of claim 1 wherein the trusted platform module utilizes a universal serial bus (USB) style connector configured to be inserted into the cassette section.

9. The data cassette of claim 1 wherein the trusted platform module is a chip included in a universal serial bus (USB) style connector configured to be inserted into the data section.

10. The data storage unit of claim 1 wherein the cassette section is configured to be insertable only into a pre-designated base section.

11. A data cassette comprising:

an interface through which solid-state storage modules are accessible to a base section;

a removable trusted platform module configured to provide security to the solid-state storage modules by authorizing operation of the cassette section and the base section when the cassette section is connected to the base section; and

a plurality of solid-state storage modules arranged in a vertical fashion from the front of the cassette section to the back of the cassette section together with a bridge board that electronically connects the interface at the back of the cassette section to one or more components at the front of the cassette section;

wherein the cassette section section further includes a gap filling material positioned between one or more internal components of the data cassette and a top plate of the data cassette or a bottom plate of the data cassette; and

wherein the gap filling material is further configured to reduce vibration within the cassette section.

12. The data cassette of claim 11 wherein the interface is configured to provide both an electrical connection between the data cassette and the base section as well as an energy transfer to the base section.

13. The data cassette of claim 1 further including one or more guides having a taper direct from the back of the data cassette to the front of the data cassette that provides self-guiding upon insertion of the data cassette into the base section.

14. The data cassette of claim 13 wherein the one or more guides are configured to provide energy transfer to the base section.

15. The data cassette of claim 13 wherein the one or more guides include a first wedge receptor opposite a second wedge receptor.

16. The data cassette of claim 11 is further configured to be insertable only into a pre-designated base section.

Assignments (15)
SECURITY AGREEMENT (SUPPLEMENTAL) Recorded Nov 14, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 069411/0208 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2024
From: SANDISK TECHNOLOGIES, INC.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 069168/0273 →
PATENT COLLATERAL AGREEMENT Recorded Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
CHANGE OF NAME Recorded Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT Recorded Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
RELEASE OF SECURITY INTEREST AT REEL 052915 FRAME 0566 Recorded Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
SECURITY INTEREST Recorded Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 29, 2018
From: SKYERA, LLC
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 046726/0328 →
CHANGE OF NAME Recorded May 4, 2015
From: SKYERA, INC.
To: SKYERA, LLC
Reel/Frame 035571/0412 →
RELEASE OF SECURITY INTEREST Recorded Jan 6, 2015
From: DELL PRODUCTS L.P.
To: SKYERA, LLC
Reel/Frame 034742/0069 →
SECURITY INTEREST Recorded Nov 11, 2014
From: SKYERA, INC.
To: WESTERN DIGITAL CAPITAL, INC.
Reel/Frame 034204/0849 →
SECURITY INTEREST Recorded Aug 14, 2014
From: SKYERA, INC.
To: DELL PRODUCTS L.P.
Reel/Frame 033546/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2013
From: HERMAN, PINCHAS; RADKE, WILLIAM; DANILAK, RADOSLAV
To: SKYERA, INC.
Reel/Frame 031648/0089 →