Reconfiguring through silicon vias in stacked multi-die packages
View Patent ↗Through silicon vias (TSVs) in a stacked multi-die integrated circuit package are controlled to assume different connection configurations as desired during field operation of the package in its normal mission mode. TSV connections may be reconfigured to connect an affected die in a manner different from, for example, a factory default connection of that die. TSV connections to the inputs and/or outputs of a die's native circuitry may be changed. A die may be disconnected altogether from an interface that interconnects dice in the stack, or a die that was originally disconnected from such an interface may be connected to the interface.
1. A method of operating a plurality of stacked integrated circuit dice, the dice being serially connected in a ring topology, each die including a plurality of vias extending therethrough for providing external access to signals on the die, the vias of each die being connected to the vias of an adjacent die, the method comprising:
causing the vias of at least one die to assume a signaling connection configuration in which native circuitry of the at least one die is connected by selected ones of the vias for signaling with an adjacent die; and
causing the vias of the at least one die to assume a signaling disconnect configuration in which the native circuitry of the at least one die is not connected for signaling with the adjacent die.
2. The method of claim 1 , wherein the signaling disconnect configuration comprises disconnection of the at least one die from an interface that interconnects at least some of the remaining dice.
3. The method of claim 1 , wherein the signaling connection configuration comprises connection of the at least one die into an interface that interconnects at least some of the remaining dice and from which said at least one die was disconnected in a previous configuration.
4. The method of claim 3 , wherein the signaling disconnect configuration comprises disconnection of at least one of the remaining dice from said interface.