Semiconductor component and method of manufacture

1. An electronic component, comprising:

a first semiconductor chip having a monolithically integrated common mode filter comprising first and second coils, the first coil having a spiral shape, a central region, an exterior region, a first terminal, and a second terminal, and the second coil having a spiral shape, the central region, the exterior region, a first terminal and a second terminal, wherein the first terminal of the first coil is formed in a first portion of the central region, the first terminal of the second coil is formed in a second portion of the central region, the second terminal of the first coil is formed in a first portion of the exterior region, and the second terminal of the second coil is formed in a second portion of the exterior region, and wherein the central region is laterally bounded by the first and second coils and the exterior region is not surrounded by the first and second coils; and

a second semiconductor chip comprising a protection device having first and second terminals and laterally adjacent the first semiconductor chip, the first terminal of the protection device coupled to the first terminal of the first coil by a first bond wire and the second terminal of the protection device coupled to the first terminal of the second coil by a second bond wire.

2. The electronic component of claim 1 , wherein the first terminals of the first and second coils are bond pads.

3. The electronic component of claim 1 , wherein the first terminals comprise copper.

4. The electronic component of claim 1 , wherein the second terminals of the first and second coils are bond pads.

5. The electronic component of claim 4 , wherein the second terminals of the first and second coils comprise an electrically conductive material selected from the group of electrically conductive materials comprising copper, aluminum, silver, and gold.

6. The electronic component of claim 1 , wherein the common mode filter is formed from a first semiconductor chip that comprises a substrate having a resistivity greater than about 100 Ohm-centimeters and the protection device is formed from a second semiconductor chip that comprises a substrate having a resistivity less than one Ohm-centimeter.

7. An electronic component, comprising:

a first semiconductor chip comprising:

a semiconductor material having a major surface;

a first dielectric layer over the semiconductor material;

a common mode filter formed over the first dielectric layer, wherein the common mode filter includes first and second coils, an interior region, and an exterior region, the first and second coils serving as a boundary for the interior region, the first coil over the first dielectric layer, the first coil having a spiral shape and first and second terminals, the first terminal of the first coil in a first portion of the interior region and the second terminal of the first coil in a first portion of the exterior region; a second dielectric layer over the first coil and the first dielectric layer; and the second coil over the second dielectric layer, the second coil having a spiral shape and first and second terminals, the first terminal of the second coil in a second portion of the interior region and the second terminal of the second coil in a second portion of the exterior region;

a second semiconductor chip laterally adjacent the first semiconductor chip and comprising:

a semiconductor material having a major surface;

a protection structure formed from the semiconductor material of the second semiconductor chip, the protection structure having a plurality of bond pads;

a first electrical interconnect that couples the second terminal of the first coil to a first bond pad of the plurality of bond pads; and

a second electrical interconnect that couples the second terminal of the second coil to a second bond pad of the plurality of bond pads.

8. The electronic component of claim 7 , wherein the second dielectric layer of the first semiconductor chip is configured to magnetically couple the first coil to the second coil.

9. The electronic component of claim 8 , wherein the first terminal of the first coil is a first bond pad having a first exposed metal surface and the first terminal of the second coil is a second bond pad having a second exposed metal surface.

10. The electronic component of claim 8 , wherein the first and second exposed metal surfaces comprise an electrically conductive material selected from the group of electrically conductive materials comprising copper, silver, gold, and aluminum.

11. The electronic component of claim 9 , wherein the first electrical interconnect is a first bond wire and the second electrical interconnect is a second bond wire.

12. The electronic component of claim 9 , wherein the second terminal of the first coil is a third bond pad having a third exposed metal surface and the second terminal of the second coil is a fourth bond pad having a fourth exposed metal surface.

13. The electronic component of claim 11 , wherein the third and fourth exposed metal surfaces comprise an electrically conductive material selected from the group of electrically conductive materials comprising copper, silver, gold, and aluminum.

14. The electronic component of claim 12 , further including a third electrical interconnect coupled to the first terminal of the first coil and a fourth electrical interconnect coupled to the first terminal of the second coil.