Substrate cleaning apparatus
A substrate cleaning apparatus cleans a surface of a substrate in a non-contact state. The substrate cleaning apparatus includes a substrate holding mechanism configured to hold and rotate the substrate, a two-fluid nozzle configured to jet a two-fluid jet flow, comprising a gas and a liquid, downwardly toward the front surface of the substrate held by the substrate holding mechanism, and a moving mechanism configured to move the two-fluid nozzle in one direction from a central portion toward a radially outer side of the substrate held by the substrate holding mechanism. The two-fluid nozzle is inclined so that an angle between an ejection center line of the two-fluid jet flow jetted from the two-fluid nozzle and a vertical line becomes a certain inclined angle, and the two-fluid jet flow collides with the front surface of the substrate at a forward position in a moving direction of the two-fluid nozzle.
1. A substrate cleaning apparatus for cleaning a substrate having a front surface and a reverse surface, said substrate cleaning apparatus comprising:
arms with chucks at the ends configured to hold and rotate the substrate, with the front surface facing upward;
a two-fluid nozzle configured to jet a two-fluid jet flow, comprising an inert gas and a cleaning liquid, downwardly toward the front surface of the substrate held by said arms with chucks at the ends; and
a support shaft with an oscillating arm configured to move said two-fluid nozzle in one direction from a central portion toward a radially outer side of the substrate held by said arms with chucks at the ends;
wherein said two-fluid nozzle is arranged to be inclined so that an angle between an ejection center line of the two-fluid jet flow jetted from said two-fluid nozzle and a vertical line becomes an inclined angle α, and the two-fluid jet flow collides with the front surface of the substrate at a forward position in a moving direction of said two-fluid nozzle;
wherein said two-fluid nozzle is further twisted so that a line formed by projecting said ejection center line of the two-fluid jet flow, jetted from said two-fluid nozzle, vertically onto the substrate intersects with a straight line formed directly under said two-fluid nozzle in said moving direction of said two-fluid nozzle, at a twisted angle β, wherein a lower end side of the two-fluid nozzle is twisted by the twisted angle β about an upper end side of the two-fluid nozzle, as a fulcrum, toward the upstream side of a rotational direction of the substrate;
wherein said two-fluid nozzle is moved by the oscillation of the oscillating arm, while keeping the inclined angle α and the twisted angle β, in one direction from a cleaning start point spaced away from the center of the substrate, through a point just above the center of the substrate, to a cleaning finish point positioned outside of the periphery of the substrate, so that an entire surface area of the substrate is cleaned.
2. The substrate cleaning apparatus according to claim 1 , wherein said inclined angle α is not less than 5° and not more than 45°.
3. The substrate cleaning apparatus according to claim 1 , wherein said angle β is not less than 5° and not more than 30°.
4. The substrate cleaning apparatus according to claim 1 , wherein said two-fluid nozzle has an ejection port having an elongated rectangular shape.
5. The substrate cleaning apparatus according to claim 1 , further comprising:
a scatter-preventive cup configured to surround a periphery of the substrate held by said arms and chucks at the ends;
wherein said scatter-preventive cup has an exhaust port, having a widened opening portion, at a forward position in said moving direction of said two-fluid nozzle.
6. The substrate cleaning apparatus according to claim 5 , wherein said exhaust port is connected to an exclusive exhaust duct.
7. The substrate cleaning apparatus according to claim 1 , wherein said two-fluid nozzle has an ejection port having a circular shape.
8. The substrate cleaning apparatus according to claim 1 , wherein said two-fluid nozzle is connected to a carrier gas supply line configured to supply an inert gas selected from N 2 gas and argon gas, and a cleaning liquid supply line configured to supply a cleaning liquid selected from pure water and water containing dissolved CO 2 gas.
9. The substrate cleaning apparatus according to claim 1 , further comprising a control panel configured to control an angular velocity and an oscillation angle of the oscillating arm.
10. The substrate cleaning apparatus according to claim 1 , wherein said arms with chucks at the ends are configured to horizontally hold and rotate the substrate.
11. A substrate processing apparatus, comprising:
a polishing unit;
a first cleaning unit configured to clean the substrate;
a second cleaning unit configured to clean the substrate transferred from the first cleaning unit by a second transfer robot, wherein the second cleaning unit is the substrate cleaning apparatus according to claim 1 ; and
a spin drying unit in which an IPA gas is ejected toward the substrate.