Self-aligned emitter-base-collector bipolar junction transistors with a single crystal raised extrinsic base
Fabrication methods, device structures, and design structures for a bipolar junction transistor. An intrinsic base layer is formed on a semiconductor substrate, an etch stop layer is formed on the intrinsic base layer, and an extrinsic base layer is formed on the etch stop layer. A trench is formed that penetrates through the extrinsic base layer to the etch stop layer. The trench is formed by etching the extrinsic base layer selective to the etch stop layer. The first trench is extended through the etch stop layer to the intrinsic base layer by etching the etch stop layer selective to the intrinsic base layer. After the trench is extended through the etch stop layer, an emitter is formed using the trench.
1. A method of forming a device structure for a bipolar junction transistor, the method comprising:
forming an intrinsic base layer on a semiconductor substrate;
forming an etch stop layer on the intrinsic base layer;
forming an extrinsic base layer on the etch stop layer;
forming a first trench penetrating through the extrinsic base layer to the etch stop layer by etching the extrinsic base layer selective to the etch stop layer;
forming a second trench penetrating through the extrinsic base layer to the etch stop layer;
extending the first trench through the etch stop layer to the intrinsic base layer by etching the etch stop layer selective to the intrinsic base layer;
extending the second trench through the etch stop layer to the intrinsic base layer; and
after the first trench is extended through the etch stop layer, forming an emitter using the first trench,
wherein the second trench is concurrently formed with the first trench, and the second trench is concurrently extended through the etch stop layer with the first trench.
2. The method of claim 1 wherein the intrinsic base layer includes a first sublayer comprised of a first semiconductor material and a second sublayer comprised of a second semiconductor material that etches selectively to the etch stop layer, and forming the intrinsic base layer on the semiconductor substrate comprises:
forming the first sublayer on the semiconductor substrate; and
forming the second sublayer on the first sublayer.
3. The method of claim 2 wherein extending the first trench through the etch stop layer comprises:
etching the etch stop layer selective to the second sublayer of the intrinsic base layer.
4. The method of claim 1 further comprising:
after the emitter is formed in the first trench, extending the second trench through the intrinsic base layer and into the semiconductor substrate; and
forming an isolation region in the semiconductor substrate using the second trench.
5. The method of claim 4 wherein the emitter includes a head that protrudes out of the first trench, and further comprising:
before the etch stop layer is etched, forming a protective layer at a sidewall of the head of the emitter and an etch mask on a top surface of the head of the emitter,
wherein the etch stop layer and the intrinsic base layer are each etched selective to the protective layer.
6. The method of claim 5 wherein the protective layer is a doped region having an opposite conductivity type from a bulk of the emitter, and forming the protective layer at the sidewall of the head of the emitter comprises:
ion implanting the sidewall of the head of the emitter to define the doped region.
7. The method of claim 5 wherein the protective layer is a dielectric spacer, and forming the protective layer at the sidewall of the head of the emitter comprises:
forming the dielectric spacer on the sidewall of the head of the emitter.
8. The method of claim 1 wherein the intrinsic base layer, the etch stop layer, and the extrinsic base layer are formed by a single epitaxial growth.
9. A method of forming a device structure for a bipolar junction transistor, the method comprising:
forming an intrinsic base layer on a semiconductor substrate;
forming an extrinsic base layer on the intrinsic base layer;
forming a trench penetrating through the extrinsic base layer to the intrinsic base layer by etching the extrinsic base layer selective to the intrinsic base layer; and
after the trench is formed, forming an emitter in the trench,
wherein the intrinsic base layer includes a first sublayer comprised of a first semiconductor material that etches selectively to the extrinsic base layer and a second sublayer comprised of a second semiconductor material, and
wherein forming the intrinsic base layer on the semiconductor substrate comprises:
forming the first sublayer on the semiconductor substrate; and
forming the second sublayer on the first sublayer, and
wherein forming the trench comprises:
etching through the second sublayer within the trench; and
stopping on the first sublayer.
10. The method of claim 9 further comprising:
epitaxially growing the first sublayer within the trench,
wherein the emitter is formed after the first sublayer is epitaxially grown within the trench.