Sensor packaging method and sensor packages
A method ( 80 ) entails providing ( 82 ) a structure ( 117 ), providing ( 100 ) a controller element ( 102, 24 ), and bonding ( 116 ) the controller element to an outer surface ( 52, 64 ) of the structure. The structure includes a sensor wafer ( 92 ) and a cap wafer ( 94 ) Inner surfaces ( 34, 36 ) of the wafers ( 92, 94 ) are coupled together, with sensors ( 30 ) interposed between the wafers. One wafer ( 94, 92 ) includes a substrate portion ( 40, 76 ) with bond pads ( 42 ) formed on its inner surface ( 34, 36 ). The other wafer ( 94, 92 ) conceals the substrate portion ( 40, 76 ). After bonding, methodology ( 80 ) entails forming ( 120 ) conductive elements ( 60 ) on the element ( 102, 24 ), removing ( 126 ) material sections ( 96, 98, 107 ) from the wafers to expose the bond pads, forming ( 130 ) electrical interconnects ( 56 ), applying ( 134 ) packaging material ( 64 ), and singulating ( 138 ) to produce sensor packages ( 20, 70 ).
1. A sensor package comprising:
a sensor structure having a sensor die and a cap, said sensor die including a sensor, a first inner surface of said cap being coupled to a second inner surface of said sensor die, one of said cap and said sensor die including a substrate portion with first bond pads located on a corresponding one of said first and second inner surfaces, and a material section of the other one of said cap and sensor die being absent;
a controller die having a top side and a bottom side opposing said top side, said top side including control circuitry and second bond pads, said bottom side being bonded to an outer surface of said sensor structure to form a stacked structure;
a second sensor located at said top side of said controller die; and
electrical interconnects attached between corresponding ones of said first bond pads and said second bond pads, said electrical interconnects being routed at least through a region where said material section is absent.
2. A sensor package as claimed in claim 1 wherein said outer surface of said sensor structure is a second outer surface of said sensor die, and said bottom side of said controller die is attached to said second outer surface of said sensor die to produce said stacked structure having said sensor die positioned between said cap and said controller die.
3. A sensor package as claimed in claim 2 wherein said cap includes said substrate portion with said first bond pads located on said first inner surface, and said first bond pads face in the same direction as said top side of said controller die.
4. A sensor package as claimed in claim 1 wherein said outer surface of said sensor structure is a first outer surface of said cap, and said bottom side of said controller die is attached to said first outer surface of said cap to produce said stacked structure having said cap positioned between said sensor die and said controller die.
5. A sensor package as claimed in claim 4 wherein said sensor die includes said substrate portion with said first bond pads located on said second inner surface, and said first bond pads face in the same direction as said top side of said controller die.
6. A sensor package as claimed in claim 1 further wherein said controller die includes bump pads formed on said top side of said controller die, and said sensor package further comprises conductive elements formed on and extending above said bump pads.
7. A sensor package as claimed in claim 1 further comprising a packaging material located over said top side of said controller die and encapsulating said control circuitry and said electrical interconnects.
8. A sensor package as claimed in claim 7 further comprising conductive elements extending above said top side of said controller die, said conductive elements being electrically connected with said controller die, and said conductive elements having a top surface that is exposed from said packaging material.
9. A sensor package comprising:
a sensor structure having a sensor die and a cap, said sensor die including a sensor, a first inner surface of said cap being coupled to a second inner surface of said sensor die, one of said cap and said sensor die including a substrate portion with first bond pads located on a corresponding one of said first and second inner surfaces, and a material section of the other one of said cap and sensor die being absent;
a controller die having a top side and a bottom side opposing said top side, said top side including control circuitry and second bond pads, said bottom side being bonded to an outer surface of said sensor structure to form a stacked structure;
an integral sensor formed within said controller die; and
electrical interconnects attached between corresponding ones of said first bond pads and said second bond pads, said electrical interconnects being routed at least through a region where said material section is absent.
10. A sensor package comprising:
a sensor structure having a sensor die and a cap, said sensor die including a sensor, a first inner surface of said cap being coupled to a second inner surface of said sensor die, one of said cap and said sensor die including a substrate portion with first bond pads located on a corresponding one of said first and second inner surfaces, and a material section of the other one of said cap and sensor die being absent;
a controller die having a top side and a bottom side opposing said top side, said top side including control circuitry and second bond pads, said bottom side being bonded to an outer surface of said sensor structure to form a stacked structure, said controller die including bump pads formed on said top side of said controller die;
conductive elements formed on said bump pads;
a second sensor located at said top side of said controller die; and
electrical interconnects attached between corresponding ones of said first bond pads and said second bond pads, said electrical interconnects being routed at least through a region where said material section is absent.
11. A sensor package as claimed in claim 10 wherein said outer surface of said sensor structure is a second outer surface of said sensor die, and said bottom side of said controller die is attached to said second outer surface of said sensor die to produce said stacked structure having said sensor die positioned between said cap and said controller die.
12. A sensor package as claimed in claim 11 wherein said cap includes said substrate portion with said first bond pads located on said first inner surface, and said first bond pads face in the same direction as said top side of said controller die.
13. A sensor package as claimed in claim 10 wherein said outer surface of said sensor structure is a first outer surface of said cap, and said bottom side of said controller die is attached to said first outer surface of said cap to produce said stacked structure having said cap positioned between said sensor die and said controller die.
14. A sensor package as claimed in claim 13 wherein said sensor die includes said substrate portion with said first bond pads located on said second inner surface, and said first bond pads face in the same direction as said top side of said controller die.
15. A sensor package as claimed in claim 10 further comprising an integral sensor formed within said controller die.
16. A sensor package as claimed in claim 10 further comprising a packaging material located over said top side of said controller die and encapsulating said control circuitry, said electrical interconnects, and said second sensor, said packaging material additionally encapsulating a portion of said conductive elements such that a top surface of said conductive elements is exposed from said packaging material.