IP Library › Assignment 075220/0239
Patent Assignment
Reel/Frame 075220/0239

Assignment of Assignor's Interest

Recorded: 2026-03-23 Pages: 41
Assignor
NXP USA, INC.
Executed: 2026-02-02
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
39, CHEMIN DU CHAMP-DES-FILLES, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Properties (10)
Sensor Package and Method of Forming Same
Patent: 9,040,355 →
Application: 13/546,902 →
Publication: US 2014/0015123
Sensor Packaging Method and Sensor Packages
Patent: 8,659,167 →
Application: 13/597,824 →
Publication: US 2014/0061948
Sensor Packaging Method and Sensor Packages
Patent: 9,165,886 →
Application: 14/151,305 →
Publication: US 2014/0124958
Sensor Packages and Method of Packaging Dies of Differing Sizes
Patent: 8,709,868 →
Application: 13/592,764 →
Publication: US 2014/0054798
Microelectronic Packages Including Patterned Die Attach Material and Methods for the Fabrication Thereof
Patent: 8,962,389 →
Application: 13/906,161 →
Publication: US 2014/0353772
Microelectronic Packages Having Hermetic Cavities and Methods for the Production Thereof
Application: 14/230,975 →
Publication: US 2016/0167952
Vent Hole Sealing in Multiple Die Sensor Device
Patent: 9,018,029 →
Application: 14/099,502 →
Shielding Mems Structures During Wafer Dicing
Patent: 9,346,671 →
Application: 14/172,479 →
Publication: US 2015/0217998
Microelectromechanical Systems (Mems) Devices with Control Circuits and Methods of Fabrication
Patent: 9,359,192 →
Application: 14/593,582 →
Etch Release Residue Removal Using Anhydrous Solution
Patent: 9,663,356 →
Application: 14/307,877 →
Publication: US 2015/0368099
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 11, 2012
From: BOWLES, PHILIP H.; HOLM, PAIGE M.; HOOPER, STEPHEN R.; ROOP, RAYMOND M.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 028532/0081 →
Assignment of Assignor's Interest Aug 23, 2012
From: BOWLES, PHILIP H.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 028836/0569 →
Assignment of Assignor's Interest Aug 29, 2012
From: BOWLES, PHILIP H.; HOLM, PAIGE M.; HOOPER, STEPHEN R.; ROOP, RAYMOND M.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 028869/0491 →
Supplement to Ip Security Agreement Apr 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030256/0625 →
Supplement to Ip Security Agreement Apr 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030256/0544 →
Supplement to Ip Security Agreement Apr 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030256/0471 →
Assignment of Assignor's Interest May 30, 2013
From: BOWLES, PHILIP H.; MAGNUS, ALAN J.; STERMER, BILL, JR.
To: FREESCALE SEMICONDUCTOR INC.
Reel/Frame 030517/0732 →
Security Agreement Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
Supplement to Ip Security Agreement Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031248/0510 →
Supplement to Ip Security Agreement Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031248/0698 →
Supplement to Ip Security Agreement Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031248/0627 →
Supplement to Ip Security Agreement Sep 20, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 031248/0750 →
Security Agreement Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
Assignment of Assignor's Interest Dec 6, 2013
From: BOWLES, PHILIP H.; HOLM, PAIGE M.; HOOPER, STEPHEN R.; LIU, LIANJUN
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 031735/0319 →
Assignment of Assignor's Interest Jan 9, 2014
From: BOWLES, PHILIP H.; HOLM, PAIGE M.; HOOPER, STEPHEN R.; ROOP, RAYMOND M.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 031930/0679 →
Assignment of Assignor's Interest Feb 4, 2014
From: MAGNUS, ALAN J.; DAWSON, CHAD S.; HOOPER, STEPHEN R.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 032138/0036 →
Supplement to Ip Security Agreement Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., COLLATERAL AGENT
Reel/Frame 032445/0689 →
Supplement to Ip Security Agreement Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 032445/0493 →
Supplement to Ip Security Agreement Mar 13, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 032445/0577 →
Assignment of Assignor's Interest Mar 31, 2014
From: BOWLES, PHILIP H.; HOOPER, STEPHEN R.
To: FREESCALE SEMICONDUCTOR INC.
Reel/Frame 032565/0042 →
Supplement to Security Agreement May 7, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 032845/0522 →
Supplement to Security Agreement May 7, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 032845/0442 →
Supplement to Security Agreement May 7, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 032845/0497 →
Assignment of Assignor's Interest Jun 18, 2014
From: KUNDALGURKI, SRIVATSA G.; MONTEZ, RUBEN B.; PFEFFER, GARY
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 033199/0082 →
Supplement to Ip Security Agreement Aug 1, 2014
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 033460/0337 →