E-fuse structure with methods of fusing the same and monitoring material leakage
The present disclosure generally provides for an e-fuse structure and corresponding method for fusing the same and monitoring material leakage. The e-fuse structure can include a metal dummy structure and an electrical fuse link substantially aligned with a portion of the metal dummy structure, wherein the metal dummy structure cools at least part of the electrical fuse link in response to an electric current passing through the electrical fuse link.
1. A method of fusing an e-fuse, the method comprising:
Obtaining a metal dummy structure in substantial vertical alignment with a portion of an electrical fuse link of the e-fuse, wherein the electrical fuse link joins two electrodes of the e-fuse, wherein the metal dummy structure is positioned laterally between the two electrodes of the e-fuse; and
creating a void in a further portion of the electrical fuse link not substantially vertically aligned with the metal dummy structure by directing an electric current through the electrical fuse link, wherein the metal dummy structure absorbs heat from the portion of the electrical fuse link substantially aligned with the metal dummy structure.
2. The method of claim 1 , wherein the aligning further comprises placing the metal dummy structure in physical contact with the electrical fuse link.
3. The method of claim 1 , wherein the directing of the electric current includes directing the electric current over a period of approximately ten microseconds and raising a temperature of the further portion of the electrical fuse link to at least approximately 800° C.
4. The method of claim 1 , further comprising placing the electrical fuse link and the metal dummy structure within a back end metal layer of a semiconductor.
5. The method of claim 1 , wherein the directed electric current comprises a fusing current.
6. The method of claim 1 , further comprising electrically coupling the electrical fuse link to at least one via.